Summary: IOP PUBLISHING JOURNAL OF PHYSICS: CONDENSED MATTER
J. Phys.: Condens. Matter 20 (2008) 095209 (5pp) doi:10.1088/0953-8984/20/9/095209
Resistance of copper nanowires and
comparison with carbon nanotube bundles
for interconnect applications using first
principles calculations
Y Zhou1,3
, S Sreekala1
, P M Ajayan2
and S K Nayak1
1
Department of Physics and Astronomy, Rensselaer Polytechnic Institute, Troy,
NY 12180, USA
2
Materials Science and Engineering Department, Rensselaer Polytechnic Institute, Troy,
NY 12180, USA
E-mail: zhouy6@rpi.edu
Received 31 October 2007, in final form 20 January 2008
Published 8 February 2008
Online at stacks.iop.org/JPhysCM/20/095209

Source: Ajayan, Pulickel M. - Department of Mechanical Engineering and Materials Science, Rice University

Collections: Materials Science