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IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 30, NO. 1, FEBRUARY 2007 19 Wafer-Level Packaging of Micromechanical
 

Summary: IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 30, NO. 1, FEBRUARY 2007 19
Wafer-Level Packaging of Micromechanical
Resonators
Paul Jayachandran Joseph, Pejman Monajemi, Member, IEEE, Farrokh Ayazi, Senior Member, IEEE, and
Paul A. Kohl, Member, IEEE
Abstract--An approach to low-cost, wafer-level packaging of
microelectromechanical systems (MEMS), e.g., microresonators,
is reported. The process does not require wafer-to-wafer bonding
and can be applied to a wide range of MEMS devices. A sacrificial
polymer-placeholder is first patterned on top of the MEMS com-
ponent of interest, followed by overcoating with a low dielectric
constant polymer overcoat. The sacrificial polymer decomposes
at elevated temperature, and the volatile products from the sac-
rificial material permeate through the overcoat polymer leaving
an embedded air-cavity around the MEMS structure. Thus, the
device is released from the sacrificial polymeric material, housed
in a protective overcoat. The protected MEMS device can then be
handled and packaged like an integrated circuit. The electrical
characteristics of the microresonators before and after packaging
were essentially the same, showing the packaging scheme does not

  

Source: Ayazi, Farrokh - School of Electrical and Computer Engineering, Georgia Institute of Technology

 

Collections: Engineering