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Summary: On-chip Optical Interconnect Roadmap: Challenges and Critical Directions
Mikhail Haurylau, Hui Chen, Jidong Zhang, Guoqing Chen, Nicholas A. Nelson,
David H. Albonesi, Eby G. Friedman and Philippe M. Fauchet
Department of Electrical and Computer Engineering
Department of Physics and Astronomy
University of Rochester, Rochester NY, 14627, USA
Department of Electrical and Computer Engineering
Cornell University, Ithaca, NY 14853, USA
Abstract-- Intrachip optical interconnects can outperform elec-
trical wires but the required parameters for optical components
are yet unknown. Here the ITRS is used as a reference point to
derive the requirements that optical components must meet.
I. INTRODUCTION
A significant effort has recently been made to develop build-
ing blocks for on-chip optical interconnects (OIs), including
light sources, waveguides, WDM (wavelength division multi-
plexing) components, modulators, detectors, etc. While some
predictions have already been made [1], [2], there is still no
clear performance specifications that optical components need
to exceed in order to effectively replace electrical interconnects
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