Summary: IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 12, NO. 6, NOVEMBER/DECEMBER 2006 1699
On-Chip Optical Interconnect Roadmap: Challenges
and Critical Directions
Mikhail Haurylau, Associate Member, IEEE, Guoqing Chen, Hui Chen, Jidong Zhang,
Nicholas A. Nelson, Student Member, IEEE, David H. Albonesi, Senior Member, IEEE,
Eby G. Friedman, Fellow, IEEE, and Philippe M. Fauchet, Fellow, IEEE
Abstract--Intrachip optical interconnects (OIs) have the poten-
tial to outperform electrical wires and to ultimately solve the com-
munication bottleneck in high-performance integrated circuits.
Performance targets and critical directions for ICs progress are
yet to be fully explored. In this paper, the International Technol-
ogy Roadmap for Semiconductors (ITRS) is used as a reference
to explore the requirements that silicon-based ICs must satisfy
to successfully outperform copper electrical interconnects (IEs).
Considering the state-of-the-art devices, these requirements are
extended to specific IC components.
Index Terms--Integrated optoelectronic circuits, optoelectron-
ics, optical interconnects (ICs), silicon photonics.
THE communications bottleneck is identified as one of