Home

About

Advanced Search

Browse by Discipline

Scientific Societies

E-print Alerts

Add E-prints

E-print Network
FAQHELPSITE MAPCONTACT US


  Advanced Search  

 
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 10, NO. 2, JUNE 2001 169 A HARPSS Polysilicon Vibrating Ring Gyroscope
 

Summary: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 10, NO. 2, JUNE 2001 169
A HARPSS Polysilicon Vibrating Ring Gyroscope
Farrokh Ayazi, Member, IEEE, and Khalil Najafi, Fellow, IEEE
Abstract--This paper presents the design, fabrication, and
testing of an 80- m-thick, 1.1 mm in diameter high aspect-ratio
(20:1) polysilicon ring gyroscope (PRG). The vibrating ring
gyroscope was fabricated through the high aspect-ratio combined
poly and single-crystal silicon MEMS technology (HARPSS).
This all-silicon single-wafer technology is capable of producing
electrically isolated vertical electrodes as tall as the main body
structure (50 to 100's ( m tall) with various size air-gaps ranging
from submicron to tens of microns. A detailed analysis has been
performed to determine the overall sensitivity of the vibrating
ring gyroscope and identify its scaling limits. An open-loop
sensitivity of 200 V/deg/s in a dynamic range of 250 deg/s was
measured under low vacuum level for a prototype device tested
in hybrid format. The resolution for a PRG with a quality factor
( ) of 1200, drive amplitude of 0.15 m, and sense node parasitic
capacitances of 2 pF was measured to be less than 1 deg/s in 1 Hz
bandwidth, limited by the noise from the circuitry. Elimination of

  

Source: Ayazi, Farrokh - School of Electrical and Computer Engineering, Georgia Institute of Technology
Georgia Institute of Technology, School of Electrical and Computer Engineering, Center for MEMS and Microsystems Technologies

 

Collections: Engineering