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  Patent Title Inventor(s) Issue Date Patent Number Full Text
A microelectromechanical systems stress sensor comprising a microelectromechanical systems silicon body. A recess is formed in the silicon body. A silicon element extends into the recess. The silicon element has limited freedom of movement within the recess. An electrical circuit in the silicon element includes a piezoresistor material that allows for sensing changes in resistance that is proportional to bending of the silicon element.
Microelectromechanical systems contact stress sensor
Kotovsky, Jack 12/25/2007 7,311,009
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A contact stress sensor includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element adjacent to the recessed portion. An electric circuit is connected to the pressure sensitive element. The circuit includes a thermal compensator and a pressure signal circuit element configured to provide a signal upon movement of the pressure sensitive element.
Contact stress sensor
Kotovsky, Jack 02/07/2012 8,109,149
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This invention provides a new method for rapidly analyzing single bioparticles to assess their material condition and state of health. The method is enabled by use of a resonant cavity apparatus to measure an optical property related to the bioparticle size and refractive index. Measuring the refractive index is useful for determining material properties of the bioparticle. The material properties depend on the biomolecular composition of the bioparticle. The biomolecular composition is, in turn, dependent on the state of health of the bioparticle. Thus, measured optical properties can be used to differentiate normal (healthy) and abnormal (diseased) states of bioparticles derived from cells or tissues. The method is illustrated with data obtained from a resonator with a gain medium. The invention also provides new methods for making multiple measurements in a single device and detecting, analyzing, and manipulating bioparticles that are much smaller than the wavelength of light.
Laser diode package with enhanced cooling
Deri, Robert J. , Kotovsky, Jack , Spadaccini, Christopher M. 06/26/2012 8,208,509
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A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.
Laser diode package with enhanced cooling
Deri, Robert J. , Kotovsky, Jack , Spadaccini, Christopher M. 06/26/2012 8,208,508
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A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.
Laser diode package with enhanced cooling
Deri, Robert J. , Kotovsky, Jack , Spadaccini, Christopher M. 09/13/2011 8,018,980
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A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.
Laser diode package with enhanced cooling
Deri, Robert J. , Kotovsky, Jack , Spadaccini, Christopher M. 06/12/2012 8,199,787
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A phosphoric acid fuel cell system comprising a porous electrolyte support, a phosphoric acid electrolyte in the porous electrolyte support, a cathode electrode contacting the phosphoric acid electrolyte, and an anode electrode contacting the phosphoric acid electrolyte.
Micro-electro-mechanical systems phosphoric acid fuel cell
Sopchak, David A. , Morse, Jeffrey D. , Upadhye, Ravindra S. , Kotovsky, Jack , Graff, Robert T. 08/17/2010 7,776,479
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A phosphoric acid fuel cell system comprising a porous electrolyte support, a phosphoric acid electrolyte in the porous electrolyte support, a cathode electrode contacting the phosphoric acid electrolyte, and an anode electrode contacting the phosphoric acid electrolyte.
Micro-electro-mechanical systems phosphoric acid fuel cell
Sopchak, David A. , Morse, Jeffrey D. , Upadhye, Ravindra S. , Kotovsky, Jack , Graff, Robert T. 12/21/2010 7,855,018
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