Optoelectronic Mounting Structure

Anderson, Gene R; Armendariz, Marcelino G; Baca, Johnny R. F.; Bryan, Robert P; Carson, Richard F; Chu, Dahwey; McCormick, Frederick B; Peterson, David W; Peterson, Gary D; Reber, Cathleen A; Reysen, Bill H

Advanced Search OptionsAdvanced Search queries use a traditional Term Search. For more info, see our FAQ.

All Fields:

Patent Title:

Abstract:

Assignee:

Inventor(s):

Patent Number:

Patent Classification (CPC):

All Classifications
A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
A23 - foods or foodstuffs
A24 - tobacco
A41 - wearing apparel
A42 - headwear
A43 - footwear
A44 - haberdashery
A45 - hand or travelling articles
A46 - brushware
A47 - furniture
A61 - medical or veterinary science
A62 - life-saving
A63 - sports
A99 - subject matter not otherwise provided for in this section
B - performing operations
B01 - physical or chemical processes or apparatus in general
B02 - crushing, pulverising, or disintegrating
B03 - separation of solid materials using liquids or using pneumatic tables or jigs
B04 - centrifugal apparatus or machines for carrying-out physical or chemical processes
B05 - spraying or atomising in general
B06 - generating or transmitting mechanical vibrations in general
B07 - separating solids from solids
B08 - cleaning
B09 - disposal of solid waste
B21 - mechanical metal-working without essentially removing material
B22 - casting
B23 - machine tools
B24 - grinding
B25 - hand tools
B26 - hand cutting tools
B27 - working or preserving wood or similar material
B28 - working cement, clay, or stone
B29 - working of plastics
B30 - presses
B31 - making articles of paper, cardboard or material worked in a manner analogous to paper
B32 - layered products
B33 - additive manufacturing technology
B41 - printing
B42 - bookbinding
B43 - writing or drawing implements
B44 - decorative arts
B60 - vehicles in general
B61 - railways
B62 - land vehicles for travelling otherwise than on rails
B63 - ships or other waterborne vessels
B64 - aircraft
B65 - conveying
B66 - hoisting
B67 - opening, closing {or cleaning} bottles, jars or similar containers
B68 - saddlery
B81 - microstructural technology
B82 - nanotechnology
B99 - subject matter not otherwise provided for in this section
C - chemistry
C01 - inorganic chemistry
C02 - treatment of water, waste water, sewage, or sludge
C03 - glass
C04 - cements
C05 - fertilisers
C06 - explosives
C07 - organic chemistry
C08 - organic macromolecular compounds
C09 - dyes
C10 - petroleum, gas or coke industries
C11 - animal or vegetable oils, fats, fatty substances or waxes
C12 - biochemistry
C13 - sugar industry
C14 - skins
C21 - metallurgy of iron
C22 - metallurgy
C23 - coating metallic material
C25 - electrolytic or electrophoretic processes
C30 - crystal growth
C40 - combinatorial technology
C99 - subject matter not otherwise provided for in this section
D - textiles
D01 - natural or man-made threads or fibres
D02 - yarns
D03 - weaving
D04 - braiding
D05 - sewing
D06 - treatment of textiles or the like
D07 - ropes
D10 - indexing scheme associated with sublasses of section d, relating to textiles
D21 - paper-making
D99 - subject matter not otherwise provided for in this section
E - fixed constructions
E01 - construction of roads, railways, or bridges
E02 - hydraulic engineering
E03 - water supply
E04 - building
E05 - locks
E06 - doors, windows, shutters, or roller blinds in general
E21 - earth drilling
E99 - subject matter not otherwise provided for in this section
F - mechanical engineering
F01 - machines or engines in general
F02 - combustion engines
F03 - machines or engines for liquids
F04 - positive - displacement machines for liquids
F05 - indexing schemes relating to engines or pumps in various subclasses of classes f01-f04
F15 - fluid-pressure actuators
F16 - engineering elements and units
F17 - storing or distributing gases or liquids
F21 - lighting
F22 - steam generation
F23 - combustion apparatus
F24 - heating
F25 - refrigeration or cooling
F26 - drying
F27 - furnaces
F28 - heat exchange in general
F41 - weapons
F42 - ammunition
F99 - subject matter not otherwise provided for in this section
G - physics
G01 - measuring
G02 - optics
G03 - photography
G04 - horology
G05 - controlling
G06 - computing
G07 - checking-devices
G08 - signalling
G09 - education
G10 - musical instruments
G11 - information storage
G12 - instrument details
G16 - information and communication technology [ict] specially adapted for specific application fields
G21 - nuclear physics
G99 - subject matter not otherwise provided for in this section
H - electricity
H01 - basic electric elements
H02 - generation
H03 - basic electronic circuitry
H04 - electric communication technique
H05 - electric techniques not otherwise provided for
H99 - subject matter not otherwise provided for in this section
Y - new / cross sectional technologies
Y02 - technologies or applications for mitigation or adaptation against climate change
Y04 - information or communication technologies having an impact on other technology areas
Y10 - technical subjects covered by former uspc

More Options ...

Title: Optoelectronic Mounting Structure

Abstract

An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.

Inventors:

Anderson, Gene R ^[1]; Armendariz, Marcelino G ^[1]; Baca, Johnny R. F. ^[1]; Bryan, Robert P ^[1]; Carson, Richard F ^[1]; Chu, Dahwey ^[1]; Duckett, III, Edwin B. ^[2]; McCormick, Frederick B ^[1]; Peterson, David W ^[3]; Peterson, Gary D ^[1]; Reber, Cathleen A ^[4]; Reysen, Bill H ^[5]

Albuquerque, NM
(Albuquerque, NM)
Sandia Park, NM
Corrales, NM
Lafayette, CO

Issue Date:: Tue Oct 05 00:00:00 EDT 2004

Research Org.:: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)

OSTI Identifier:: 879685

Patent Number(s):: 6799902

Application Number:: 09/749283

Assignee:: Emcore Corporation (Somerset, NJ)

Patent Classifications (CPCs):: G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Show more

G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
G02B6/266 - {the optical element being an attenuator}
G02B6/4204 - {the coupling comprising intermediate optical elements, e.g. lenses, holograms
G02B6/4206 - {Optical features
G02B6/4207 - {with optical elements reducing the sensitivity to optical feedback
G02B6/421 - {the intermediate optical component consisting of a short length of fibre, e.g. fibre stub}
G02B6/4212 - {the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel}
G02B6/4221 - {involving a visual detection of the position of the elements, e.g. by using a microscope or a camera}
G02B6/4224 - {using visual alignment markings, e.g. index methods}
G02B6/4227 - {Active alignment methods, e.g. procedures and algorithms}
G02B6/4239 - {Adhesive bonding
G02B6/4253 - {by embedding housing components in an adhesive or a polymer material
G02B6/4269 - {with heat sinks or radiation fins}
G02B6/4277 - {Protection against electromagnetic interference [EMI], e.g. shielding means
G02B6/4281 - {the printed circuit boards being flexible
G02B6/4283 - {with electrical insulation means}
G02B6/4286 - {Optical modules with optical power monitoring}
G02B6/4292 - {the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2224/48091 - Arched
H01L2224/48137 - the bodies being arranged next to each other, e.g. on a common substrate
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2924/3025 - Electromagnetic shielding

Show less

DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Citation Formats


                    Anderson, Gene R, Armendariz, Marcelino G, Baca, Johnny R. F., Bryan, Robert P, Carson, Richard F, Chu, Dahwey, Duckett, III, Edwin B., McCormick, Frederick B, Peterson, David W, Peterson, Gary D, Reber, Cathleen A, and Reysen, Bill H. Optoelectronic Mounting Structure.  United States: N. p., 2004. 
        Web.

Copy to clipboard


                    Anderson, Gene R, Armendariz, Marcelino G, Baca, Johnny R. F., Bryan, Robert P, Carson, Richard F, Chu, Dahwey, Duckett, III, Edwin B., McCormick, Frederick B, Peterson, David W, Peterson, Gary D, Reber, Cathleen A, & Reysen, Bill H. Optoelectronic Mounting Structure.  United States.

Copy to clipboard


                    Anderson, Gene R, Armendariz, Marcelino G, Baca, Johnny R. F., Bryan, Robert P, Carson, Richard F, Chu, Dahwey, Duckett, III, Edwin B., McCormick, Frederick B, Peterson, David W, Peterson, Gary D, Reber, Cathleen A, and Reysen, Bill H. Tue .  
        "Optoelectronic Mounting Structure".  United States.  https://www.osti.gov/servlets/purl/879685.

Copy to clipboard


                    
@article{osti_879685,

  title        = {Optoelectronic Mounting Structure},

  author       = {Anderson, Gene R and Armendariz, Marcelino G and Baca, Johnny R. F. and Bryan, Robert P and Carson, Richard F and Chu, Dahwey and Duckett, III, Edwin B. and McCormick, Frederick B and Peterson, David W and Peterson, Gary D and Reber, Cathleen A and Reysen, Bill H},

  abstractNote = {An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Oct 05 00:00:00 EDT 2004},

  month        = {Tue Oct 05 00:00:00 EDT 2004}

}

Copy to clipboard

Patent:

Save / Share:

Export Metadata

Save to My Library

Works referenced in this record:

Characteristics of VCSEL arrays for parallel optical interconnects
conference, May 1996

Lebby, M.; Gaw, C. A.; Jiang, Wenbin
1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.517404

OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools
conference, January 1996

Wong, Y. M.; Muehlner, D. J.; Faudskar, C. C.
1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.517403

Parallel optical interconnections for future broad band systems, based on the "fibre in board technology"
conference, January 1996

De Pestel, G.; Picard, A.; Vandewege, J.
1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.517402

A complete sub-system of parallel optical interconnects for telecom applications
conference, January 1996

Niburg, M.; Eriksen, P.; Gustafsson, K.
1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.517401

The PONI optoelectronic platform
conference, January 1999

Giboney, K.; Rosenberg, P.; Yuen, A.
1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting. IEEE Lasers and Electro-Optics Society 1999 Annual Meeting (Cat. No.99CH37009)
https://doi.org/10.1109/LEOS.1999.813458

The P-VixeLink/sup TM/ multichannel optical interconnect
conference, January 1996

Swirhun, S.; Dudek, M.; Neumann, R.
1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.517408

The PONI-1 parallel-optical link
conference, January 1999

Rosenberg, P.; Giboney, K.; Yuen, A.
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
https://doi.org/10.1109/ECTC.1999.776268

Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications
conference, January 1996

Liu, Y. S.; Wojnarowski, R. J.; Hennessy, W. A.
1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.517407

Power minimization and technology comparisons for digital free-space optoelectronic interconnections
journal, April 1999

Kibar, O.; Van Blerkom, D. A.; Fan, Chi
Journal of Lightwave Technology, Vol. 17, Issue 4, p. 546-555
https://doi.org/10.1109/50.754783

Gigabyte/s data communications with the POLO parallel optical link
conference, January 1996

Hahn, K. H.; Giboney, K. S.; Wilson, R. E.
1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.517406

The Jitney Parallel Optical Interconnect
conference, May 1996

Crow, J. D.; Choi, Joong-Ho; Cohen, M. S.
1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.517405

1 Gb/s VCSEL/CMOS flip-chip 2-D-array interconnects and associated diffractive optics
conference, January 1999

Simonis, G. J.; Pham, J.; Koley, B.
Proceedings. 6th International Conference on Parallel Interconnects (PI'99) (Formerly Known as MPPOI)
https://doi.org/10.1109/PI.1999.806394

Low-power modular parallel photonic data links
conference, January 1996

Carson, R. F.; Lovejoy, M. L.; Lear, K. L.
1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.551417

Low cost molded packaging for optical data links
conference, January 1994

Robinson, S. D.; Acarlar, M. S.; Chen, Y. C.
1994 Proceedings. 44th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1994.367572

1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection
conference, January 1996

Nagahori, T.; Miyoshi, K.; Hatakeyama, I.
1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
https://doi.org/10.1109/ECTC.1996.517400

High alignment tolerance coupling scheme for multichannel laser diode/singlemode fibre modules using a tapered waveguide array
journal, September 1994

Cheong, J. -M.; Jhee, Y. -K.; Seo, J. -W.
Electronics Letters, Vol. 30, Issue 18
https://doi.org/10.1049/el:19941052

Similar Records in DOE Patents and OSTI.GOV collections:

Gas turbine structural mounting arrangement between combustion gas duct annular chamber and turbine vane carrier

Patent Wiebe, David J.; Charron, Richard C.; Morrison, Jay A.

A gas turbine engine ducting arrangement (10), including: an annular chamber (14) configured to receive a plurality of discrete flows of combustion gases originating in respective can combustors and to deliver the discrete flows to a turbine inlet annulus, wherein the annular chamber includes an inner diameter (52) and an outer diameter (60); an outer diameter mounting arrangement (34) configured to permit relative radial movement and to prevent relative axial and circumferential movement between the outer diameter and a turbine vane carrier (20); and an inner diameter mounting arrangement (36) including a bracket (64) secured to the turbine vane carrier,more » « less
Full Text Available
Nozzle and shroud assembly mounting structure

Patent Faulder, Leslie J [San Diego, CA]; Frey, deceased, Gary A. (late of Seattle, WA); Nielsen, Engward W [El Cajon, CA]; ...

The present nozzle and shroud assembly mounting structure configuration increases component life and reduces maintenance by reducing internal stress between the mounting structure having a preestablished rate of thermal expansion and the nozzle and shroud assembly having a preestablished rate of thermal expansion being less than that of the mounting structure. The mounting structure includes an outer sealing portion forming a cradling member in which an annular ring member is slidably positioned. The mounting structure further includes an inner mounting portion to which a hooked end of the nozzle and shroud assembly is attached. As the inner mounting portion expandsmore » « less
Full Text Available
Evacuated optical structure comprising optical bench mounted to sidewall of vacuum chamber in a manner which inhibits deflection and rotation of the optical bench

Patent Bowers, Joel M [Livermore, CA]

An improved evacuated optical structure is disclosed comprising an optical bench mounted in a vacuum vessel in a manner which inhibits transmission of movement of the vacuum vessel to the optical bench, yet provides a compact and economical structure. The vacuum vessel is mounted, through a sidewall thereof, to a support wall at four symmetrically positioned and spaced apart areas, each of which comprises a symmetrically positioned group of mounting structures passing through the sidewall of the vacuum vessel. The optical bench is pivotally secured to the vacuum vessel by four symmetrically spaced apart bolts and spherical bearings, each ofmore » « less
Full Text Available
Electrical wiring box with structure for fast device mounting

Patent Johnston, Earl S [Mineral Wells, WV]

An electrical wiring box of molded insulating material is provided with bosses having screw holes for receiving a mounting screw that include two colinear portions of which a first portion proximate the front surface has an internal configuration, such as molded threads, that engage the mounting screw while permitting the mounting screw to be manually inserted therethrough without turning because of flexibility built into the boss structure. A second portion of the screw hole is of greater restriction for securely engaging the screw such as by self tapping. The flexibility of the boss is provided by a first center slotmore » « less
Full Text Available
Housing And Mounting Structure

Patent Anderson, Gene R [Albuquerque, NM]; Armendariz, Marcelino G [Albuquerque, NM]; Baca, Johnny R.F. [Albuquerque, NM]; ...

This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at leastmore » « less
Full Text Available

Similar Records

Title: Optoelectronic Mounting Structure

Abstract

Citation Formats

Characteristics of VCSEL arrays for parallel optical interconnects conference, May 1996

OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools conference, January 1996

Parallel optical interconnections for future broad band systems, based on the "fibre in board technology" conference, January 1996

A complete sub-system of parallel optical interconnects for telecom applications conference, January 1996

The PONI optoelectronic platform conference, January 1999

The P-VixeLink/sup TM/ multichannel optical interconnect conference, January 1996

The PONI-1 parallel-optical link conference, January 1999

Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications conference, January 1996

Power minimization and technology comparisons for digital free-space optoelectronic interconnections journal, April 1999

Gigabyte/s data communications with the POLO parallel optical link conference, January 1996

The Jitney Parallel Optical Interconnect conference, May 1996

1 Gb/s VCSEL/CMOS flip-chip 2-D-array interconnects and associated diffractive optics conference, January 1999

Low-power modular parallel photonic data links conference, January 1996

Low cost molded packaging for optical data links conference, January 1994

1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection conference, January 1996

High alignment tolerance coupling scheme for multichannel laser diode/singlemode fibre modules using a tapered waveguide array journal, September 1994

Characteristics of VCSEL arrays for parallel optical interconnects
conference, May 1996

OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools
conference, January 1996

Parallel optical interconnections for future broad band systems, based on the "fibre in board technology"
conference, January 1996

A complete sub-system of parallel optical interconnects for telecom applications
conference, January 1996

The PONI optoelectronic platform
conference, January 1999

The P-VixeLink/sup TM/ multichannel optical interconnect
conference, January 1996

The PONI-1 parallel-optical link
conference, January 1999

Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications
conference, January 1996

Power minimization and technology comparisons for digital free-space optoelectronic interconnections
journal, April 1999

Gigabyte/s data communications with the POLO parallel optical link
conference, January 1996

The Jitney Parallel Optical Interconnect
conference, May 1996

1 Gb/s VCSEL/CMOS flip-chip 2-D-array interconnects and associated diffractive optics
conference, January 1999

Low-power modular parallel photonic data links
conference, January 1996

Low cost molded packaging for optical data links
conference, January 1994

1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection
conference, January 1996

High alignment tolerance coupling scheme for multichannel laser diode/singlemode fibre modules using a tapered waveguide array
journal, September 1994