Method for making MgO buffer layers on rolled nickel or copper as superconductor substrates
Abstract
Buffer layer architectures are epitaxially deposited on biaxially-textured rolled-Ni and/or Cu substrates for high current conductors, and more particularly buffer layer architectures such as MgO/Ag/Pt/Ni, MgO/Ag/Pd/Ni, MgO/Ag/Ni, MgO/Ag/Pd/Cu, MgO/Ag/Pt/Cu, and MgO/Ag/Cu. Techniques used to deposit these buffer layers include electron beam evaporation, thermal evaporation, rf magnetron sputtering, pulsed laser deposition, metal-organic chemical vapor deposition (MOCVD), combustion CVD, and spray pyrolysis.
- Inventors:
-
- Knoxville, TN
- (Andersonville, TN)
- Issue Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- OSTI Identifier:
- 874823
- Patent Number(s):
- 6468591
- Assignee:
- UT-Battelle, LLC ()
- Patent Classifications (CPCs):
-
C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- DOE Contract Number:
- AC05-96OR22464
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; mgo; buffer; layers; rolled; nickel; copper; superconductor; substrates; layer; architectures; epitaxially; deposited; biaxially-textured; rolled-ni; andor; current; conductors; mgoagptni; mgoagpdni; mgoagni; mgoagpdcu; mgoagptcu; mgoagcu; techniques; deposit; electron; beam; evaporation; thermal; rf; magnetron; sputtering; pulsed; laser; deposition; metal-organic; chemical; vapor; mocvd; combustion; cvd; spray; pyrolysis; electron beam; vapor deposition; chemical vapor; pulsed laser; buffer layer; laser deposition; layer architectures; current conductor; superconductor substrates; biaxially-textured rolled; /427/
Citation Formats
Paranthaman, Mariappan, Goyal, Amit, Kroeger, Donald M, and List, III, Frederic A. Method for making MgO buffer layers on rolled nickel or copper as superconductor substrates. United States: N. p., 2002.
Web.
Paranthaman, Mariappan, Goyal, Amit, Kroeger, Donald M, & List, III, Frederic A. Method for making MgO buffer layers on rolled nickel or copper as superconductor substrates. United States.
Paranthaman, Mariappan, Goyal, Amit, Kroeger, Donald M, and List, III, Frederic A. Tue .
"Method for making MgO buffer layers on rolled nickel or copper as superconductor substrates". United States. https://www.osti.gov/servlets/purl/874823.
@article{osti_874823,
title = {Method for making MgO buffer layers on rolled nickel or copper as superconductor substrates},
author = {Paranthaman, Mariappan and Goyal, Amit and Kroeger, Donald M and List, III, Frederic A.},
abstractNote = {Buffer layer architectures are epitaxially deposited on biaxially-textured rolled-Ni and/or Cu substrates for high current conductors, and more particularly buffer layer architectures such as MgO/Ag/Pt/Ni, MgO/Ag/Pd/Ni, MgO/Ag/Ni, MgO/Ag/Pd/Cu, MgO/Ag/Pt/Cu, and MgO/Ag/Cu. Techniques used to deposit these buffer layers include electron beam evaporation, thermal evaporation, rf magnetron sputtering, pulsed laser deposition, metal-organic chemical vapor deposition (MOCVD), combustion CVD, and spray pyrolysis.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 01 00:00:00 EST 2002},
month = {Tue Jan 01 00:00:00 EST 2002}
}
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