Buffer layers on rolled nickel or copper as superconductor substrates

Paranthaman, Mariappan; Lee, Dominic F; Kroeger, Donald M; Goyal, Amit

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Title: Buffer layers on rolled nickel or copper as superconductor substrates

Abstract

Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /CeO.sub.2 /Ni, RE.sub.2 O.sub.3 /Ni (RE=Rare Earth), and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /CeO.sub.2 /Cu, RE.sub.2 O.sub.3 /Cu, and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approach, which includes chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.

Inventors:

Paranthaman, Mariappan ^[1]; Lee, Dominic F ^[1]; Kroeger, Donald M ^[1]; Goyal, Amit ^[1]

Knoxville, TN

Issue Date:: Sat Jan 01 00:00:00 EST 2000

Research Org.:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

OSTI Identifier:: 873388

Patent Number(s):: 6150034

Assignee:: UT-Battelle, LLC (Oak Ridge, TN)

Patent Classifications (CPCs):: C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL

C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH

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C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
C23C14/08 - Oxides
C23C14/087 - {of copper or solid solutions thereof}

C - CHEMISTRY C30 - CRYSTAL GROWTH C30B - SINGLE-CRYSTAL-GROWTH
C30B23/02 - Epitaxial-layer growth
C30B29/22 - Complex oxides
C30B29/225 - {based on rare earth copper oxides, e.g. high T-superconductors}

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DOE Contract Number:: AC05-96OR22464

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: buffer; layers; rolled; nickel; copper; superconductor; substrates; layer; architectures; epitaxially; deposited; biaxially-textured; alloys; current; conductors; particularly; ysz; ceo; rare; earth; cu; deposition; methods; physical; vapor; techniques; electron-beam; evaporation; rf; magnetron; sputtering; pulsed; laser; thermal; solution; precursor; approach; chemical; combustion; cvd; metal-organic; decomposition; sol-gel; processing; plasma; spray; sol-gel process; magnetron sputter; rf magnetron; current conductor; current conductors; deposition methods; magnetron sputtering; deposition method; plasma spray; epitaxially deposited; buffer layer; chemical vapor; rare earth; vapor deposition; pulsed laser; physical vapor; deposition techniques; layer architectures; buffer layers; laser deposition; solution precursor; rolled substrates; sol-gel processing; biaxially-textured rolled; particularly buffer; metal-organic decomposition; thermal evaporation; superconductor substrates; deposition technique; combustion cvd; rolled nickel; electron-beam evaporation; beam evaporation; /428/

Citation Formats


                    Paranthaman, Mariappan, Lee, Dominic F, Kroeger, Donald M, and Goyal, Amit. Buffer layers on rolled nickel or copper as superconductor substrates.  United States: N. p., 2000. 
        Web.

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                    Paranthaman, Mariappan, Lee, Dominic F, Kroeger, Donald M, & Goyal, Amit. Buffer layers on rolled nickel or copper as superconductor substrates.  United States.

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                    Paranthaman, Mariappan, Lee, Dominic F, Kroeger, Donald M, and Goyal, Amit. Sat .  
        "Buffer layers on rolled nickel or copper as superconductor substrates".  United States.  https://www.osti.gov/servlets/purl/873388.

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@article{osti_873388,

  title        = {Buffer layers on rolled nickel or copper as superconductor substrates},

  author       = {Paranthaman, Mariappan and Lee, Dominic F and Kroeger, Donald M and Goyal, Amit},

  abstractNote = {Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /CeO.sub.2 /Ni, RE.sub.2 O.sub.3 /Ni (RE=Rare Earth), and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /CeO.sub.2 /Cu, RE.sub.2 O.sub.3 /Cu, and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approach, which includes chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Sat Jan 01 00:00:00 EST 2000},

  month        = {Sat Jan 01 00:00:00 EST 2000}

}

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Works referenced in this record:

High current YBa ₂ Cu ₃ O _7−δ thick films on flexible nickel substrates with textured buffer layers
journal, October 1994

Wu, X. D.; Foltyn, S. R.; Arendt, P.
Applied Physics Letters, Vol. 65, Issue 15
https://doi.org/10.1063/1.112830

Growth of biaxially textured buffer layers on rolled-Ni substrates by electron beam evaporation
journal, February 1997

Paranthaman, M.; Goyal, A.; List, F. A.
Physica C: Superconductivity, Vol. 275, Issue 3-4
https://doi.org/10.1016/S0921-4534(96)00713-7

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Similar Records

Title: Buffer layers on rolled nickel or copper as superconductor substrates

Abstract

Citation Formats

High current YBa 2 Cu 3 O 7−δ thick films on flexible nickel substrates with textured buffer layers journal, October 1994

Growth of biaxially textured buffer layers on rolled-Ni substrates by electron beam evaporation journal, February 1997

High current YBa ₂ Cu ₃ O _7−δ thick films on flexible nickel substrates with textured buffer layers
journal, October 1994

Growth of biaxially textured buffer layers on rolled-Ni substrates by electron beam evaporation
journal, February 1997