DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Heat pipe with embedded wick structure

Abstract

A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.

Inventors:
 [1];  [1];  [1];  [1];  [2]
  1. Albuquerque, NM
  2. Corrales, NM
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
871638
Patent Number(s):
5769154
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
heat; pipe; embedded; wick; structure; maximizes; capillary; pumping; capability; attached; devices; integrated; circuits; evaporates; fluid; vapor; cools; condenses; dissipation; surface; condensate; collects; returns; capillary pumping; heat pipe; integrated circuits; integrated circuit; heat dissipation; wick structure; embedded wick; pumping capability; circuits evaporates; vapor cools; attached devices; maximizes capillary; /165/126/

Citation Formats

Adkins, Douglas Ray, Shen, David S, Tuck, Melanie R, Palmer, David W, and Grafe, V Gerald. Heat pipe with embedded wick structure. United States: N. p., 1998. Web.
Adkins, Douglas Ray, Shen, David S, Tuck, Melanie R, Palmer, David W, & Grafe, V Gerald. Heat pipe with embedded wick structure. United States.
Adkins, Douglas Ray, Shen, David S, Tuck, Melanie R, Palmer, David W, and Grafe, V Gerald. Tue . "Heat pipe with embedded wick structure". United States. https://www.osti.gov/servlets/purl/871638.
@article{osti_871638,
title = {Heat pipe with embedded wick structure},
author = {Adkins, Douglas Ray and Shen, David S and Tuck, Melanie R and Palmer, David W and Grafe, V Gerald},
abstractNote = {A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jun 23 00:00:00 EDT 1998},
month = {Tue Jun 23 00:00:00 EDT 1998}
}

Works referenced in this record:

Deep and fast plasma etching for silicon micromachining
journal, January 1995


The LIGA technique-what are the new opportunities
journal, September 1992