Soldering instrument safety improvements
Abstract
A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.
- Inventors:
-
- Jefferson Boro, PA
- Delmont, PA
- Issue Date:
- OSTI Identifier:
- 870449
- Patent Number(s):
- 5524809
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- soldering; instrument; safety; improvements; safe; device; retractable; heat; shield; moved; position; solder; tip; exposed; operation; covered; preferably; biased; towards; locked; ease; equipped; vacuum; serve; guide; flow; gases; non-heatsinking; plastic; heat shield; biased towards; /228/219/
Citation Formats
Kosslow, William J, and Giron, Ronald W. Soldering instrument safety improvements. United States: N. p., 1996.
Web.
Kosslow, William J, & Giron, Ronald W. Soldering instrument safety improvements. United States.
Kosslow, William J, and Giron, Ronald W. Mon .
"Soldering instrument safety improvements". United States. https://www.osti.gov/servlets/purl/870449.
@article{osti_870449,
title = {Soldering instrument safety improvements},
author = {Kosslow, William J and Giron, Ronald W},
abstractNote = {A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 1996},
month = {Mon Jan 01 00:00:00 EST 1996}
}
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