Molecular assemblies as protective barriers and adhesion promotion interlayer
Abstract
A protective diffusion barrier having adhesive qualifies for metalized surfaces is provided by a passivating agent having the formula HS--(CH.sub.2).sub.11 --COOH Which forms a very dense, transparent organized molecular assembly or layer that is impervious to water, alkali, and other impurities and corrosive substances that typically attack metal surfaces.
- Inventors:
-
- Lakewood, CO
- Denver, CO
- Lafayette, CO
- Issue Date:
- Research Org.:
- Midwest Research Institute, Kansas City, MO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 870272
- Patent Number(s):
- 5487792
- Assignee:
- Midwest Research Institute (Kansas City, MO)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B82 - NANOTECHNOLOGY B82Y - SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC02-83CH10093
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- molecular; assemblies; protective; barriers; adhesion; promotion; interlayer; diffusion; barrier; adhesive; qualifies; metalized; surfaces; provided; passivating; agent; formula; hs-; 11; -cooh; forms; dense; transparent; organized; assembly; layer; impervious; water; alkali; impurities; corrosive; substances; typically; attack; metal; diffusion barrier; metal surface; metal surfaces; protective diffusion; typically attack; protective barrier; protective barriers; corrosive substances; /136/106/148/359/427/428/438/
Citation Formats
King, David E, Czanderna, Alvin W, and Kennedy, Cheryl E. Molecular assemblies as protective barriers and adhesion promotion interlayer. United States: N. p., 1996.
Web.
King, David E, Czanderna, Alvin W, & Kennedy, Cheryl E. Molecular assemblies as protective barriers and adhesion promotion interlayer. United States.
King, David E, Czanderna, Alvin W, and Kennedy, Cheryl E. Mon .
"Molecular assemblies as protective barriers and adhesion promotion interlayer". United States. https://www.osti.gov/servlets/purl/870272.
@article{osti_870272,
title = {Molecular assemblies as protective barriers and adhesion promotion interlayer},
author = {King, David E and Czanderna, Alvin W and Kennedy, Cheryl E},
abstractNote = {A protective diffusion barrier having adhesive qualifies for metalized surfaces is provided by a passivating agent having the formula HS--(CH.sub.2).sub.11 --COOH Which forms a very dense, transparent organized molecular assembly or layer that is impervious to water, alkali, and other impurities and corrosive substances that typically attack metal surfaces.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 1996},
month = {Mon Jan 01 00:00:00 EST 1996}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Thin film characteristics of fluorine-substituted monolayers prepared by chemical adsorption from solution
journal, August 1993
- Mino, Norihisa; Ogawa, Kazufumi; Minoda, Takatoshi
- Thin Solid Films, Vol. 230, Issue 2
Orientation and chemistry of alkyl thiolates on the Ni(100) surface
journal, August 1993
- Parker, Bryan; Gellman, Andrew J.
- Surface Science, Vol. 292, Issue 3
Bonding of vapor deposited gold to glass using organosilane primers
journal, January 1987
- Chaudhury, M. K.; Plueddemann, E. P.
- Journal of Adhesion Science and Technology, Vol. 1, Issue 1
Self-assembled monolayers of n-alkanethiolates on copper are barrier films that protect the metal against oxidation by air
journal, November 1992
- Laibinis, Paul E.; Whitesides, George M.
- Journal of the American Chemical Society, Vol. 114, Issue 23
SelfâAssembled Layers of Alkanethiols on Copper for Protection Against Corrosion
journal, February 1993
- Yamamoto, Yuichi; Nishihara, Hiroshi; Aramaki, Kunitsugu
- Journal of The Electrochemical Society, Vol. 140, Issue 2