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Title: Methods for patterned deposition on a substrate

Abstract

A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto.

Inventors:
 [1];  [1];  [1];  [1]
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  1. Albuquerque, NM
Issue Date:
Research Org.:
AT&T
OSTI Identifier:
869700
Patent Number(s):
5380474
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
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DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
methods; patterned; deposition; substrate; method; described; depositions; material; surface; polymeric; etched; form; layer; enhanced; adhesions; characteristics; selected; portions; removed; define; pattern; diminished; adhesion; conductor; remaining; embodiment; ptfe; chemically; improve; copper; thereto; thereafter; irradiated; laser; beam; remove; patterns; polymeric substrate; laser beam; selected portion; selected portions; adhesion characteristics; etched surface; chemically etched; enhanced adhesion; patterned deposition; /264/216/427/

Citation Formats

Rye, Robert R, Ricco, Antonio J, Hampden-Smith, M J, and Kodas, T T. Methods for patterned deposition on a substrate. United States: N. p., 1995. Web.
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Rye, Robert R, Ricco, Antonio J, Hampden-Smith, M J, & Kodas, T T. Methods for patterned deposition on a substrate. United States.
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Rye, Robert R, Ricco, Antonio J, Hampden-Smith, M J, and Kodas, T T. Sun . "Methods for patterned deposition on a substrate". United States. https://www.osti.gov/servlets/purl/869700.
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@article{osti_869700,
title = {Methods for patterned deposition on a substrate},
author = {Rye, Robert R and Ricco, Antonio J and Hampden-Smith, M J and Kodas, T T},
abstractNote = {A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Jan 01 00:00:00 EST 1995},
month = {Sun Jan 01 00:00:00 EST 1995}
}
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