Microchannel cooling of face down bonded chips
Abstract
Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.
- Inventors:
-
- Berkeley, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- OSTI Identifier:
- 868813
- Patent Number(s):
- 5218515
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- microchannel; cooling; bonded; chips; applied; flip-chip; integrated; circuits; manner; maintains; advantages; bonds; overcoming; difficulties; encountered; technique; suited; multichip; circuit; boards; plane; stacks; dimensional; interconnect; structure; mounted; board; control; collapse; essentially; permanently; coupled; chip; coolant; delivery; manifold; delivers; seal; consisting; compressible; elastomer; provided; connected; form; replaceable; module; easily; decoupled; supply; manifolds; disposed; stack; supplies; circuit board; integrated circuits; integrated circuit; circuit boards; circuit chip; channel structure; interconnect structure; supply manifold; circuit chips; microchannel cooling; chip bond; /361/257/
Citation Formats
Bernhardt, Anthony F. Microchannel cooling of face down bonded chips. United States: N. p., 1993.
Web.
Bernhardt, Anthony F. Microchannel cooling of face down bonded chips. United States.
Bernhardt, Anthony F. Fri .
"Microchannel cooling of face down bonded chips". United States. https://www.osti.gov/servlets/purl/868813.
@article{osti_868813,
title = {Microchannel cooling of face down bonded chips},
author = {Bernhardt, Anthony F},
abstractNote = {Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Fri Jan 01 00:00:00 EST 1993},
month = {Fri Jan 01 00:00:00 EST 1993}
}
Works referenced in this record:
Narrow Channel Forced Air Heat Sink
journal, March 1984
- Goldberg, N.
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 7, Issue 1
High-performance heat sinking for VLSI
journal, May 1981
- Tuckerman, D. B.; Pease, R. F. W.
- IEEE Electron Device Letters, Vol. 2, Issue 5