Multiwire conductor having greatly increased interwire resistance and method for making same
Abstract
An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu.sub.5 Sn.sub.6 with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.
- Inventors:
-
- Seattle, WA
- Bellport, NY
- Issue Date:
- Research Org.:
- Associated Universities, Inc., Upton, NY (United States)
- OSTI Identifier:
- 864842
- Patent Number(s):
- 4426550
- Application Number:
- 06/358,085
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01B - CABLES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01F - MAGNETS
- DOE Contract Number:
- AC02-76CH00016
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- multiwire; conductor; greatly; increased; interwire; resistance; method; improved; type; mechanically; stabilized; based; solder; filler; filled; heated; temperature; melting; period; allow; substantial; amount; copper; dissolved; wires; comprising; forms; brittle; intermetallic; compound; cu; cooling; flexed; causing; random; cracking; increasing; subject; particularly; adapted; braided; ribbon-type; superconductors; particularly adapted; intermetallic compound; substantial amount; greatly increased; brittle intermetallic; solder filled; multiwire conductor; interwire resistance; mechanically stabilized; solder filler; improved multiwire; greatly increase; increased interwire; filled conductor; metallic compound; /174/29/156/228/335/423/505/
Citation Formats
Luhman, Thomas, and Suenaga, Masaki. Multiwire conductor having greatly increased interwire resistance and method for making same. United States: N. p., 1984.
Web.
Luhman, Thomas, & Suenaga, Masaki. Multiwire conductor having greatly increased interwire resistance and method for making same. United States.
Luhman, Thomas, and Suenaga, Masaki. Tue .
"Multiwire conductor having greatly increased interwire resistance and method for making same". United States. https://www.osti.gov/servlets/purl/864842.
@article{osti_864842,
title = {Multiwire conductor having greatly increased interwire resistance and method for making same},
author = {Luhman, Thomas and Suenaga, Masaki},
abstractNote = {An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu.sub.5 Sn.sub.6 with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 17 00:00:00 EST 1984},
month = {Tue Jan 17 00:00:00 EST 1984}
}
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