Inert electrode connection
Abstract
An inert electrode connection is disclosed wherein a layer of inert electrode material is bonded to a layer of conductive material by providing at least one intermediate layer of material therebetween comprising a predetermined ratio of inert material to conductive material. In a preferred embodiment, the connection is formed by placing in a die a layer of powdered inert material, at least one layer of a mixture of powdered inert material and conductive material, and a layer of powdered conductive material. The connection is then formed by pressing the material at 15,000--20,000 psi to form a powder compact and then densifying the powder compact in an inert or reducing atmosphere at a temperature of 1,200--1,500 C. 5 figs.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 7146616
- Patent Number(s):
- 4500406
- Application Number:
- PPN: US 6-560602
- Assignee:
- Aluminum Co. of America, Pittsburgh, PA (United States)
- DOE Contract Number:
- FC07-80CS40158
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 12 Dec 1983
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; ELECTRIC CONDUCTORS; BONDING; ELECTRODES; COMPACTING; CONTROLLED ATMOSPHERES; FABRICATION; POWDERS; ATMOSPHERES; JOINING; 426000* - Engineering- Components, Electron Devices & Circuits- (1990-)
Citation Formats
Weyand, J D, Woods, R W, DeYoung, D H, and Ray, S P. Inert electrode connection. United States: N. p., 1985.
Web.
Weyand, J D, Woods, R W, DeYoung, D H, & Ray, S P. Inert electrode connection. United States.
Weyand, J D, Woods, R W, DeYoung, D H, and Ray, S P. Tue .
"Inert electrode connection". United States.
@article{osti_7146616,
title = {Inert electrode connection},
author = {Weyand, J D and Woods, R W and DeYoung, D H and Ray, S P},
abstractNote = {An inert electrode connection is disclosed wherein a layer of inert electrode material is bonded to a layer of conductive material by providing at least one intermediate layer of material therebetween comprising a predetermined ratio of inert material to conductive material. In a preferred embodiment, the connection is formed by placing in a die a layer of powdered inert material, at least one layer of a mixture of powdered inert material and conductive material, and a layer of powdered conductive material. The connection is then formed by pressing the material at 15,000--20,000 psi to form a powder compact and then densifying the powder compact in an inert or reducing atmosphere at a temperature of 1,200--1,500 C. 5 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Feb 19 00:00:00 EST 1985},
month = {Tue Feb 19 00:00:00 EST 1985}
}
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