DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Bottom head to shell junction assembly for a boiling water nuclear reactor

Abstract

A bottom head to shell junction assembly which, in one embodiment, includes an annular forging having an integrally formed pump deck and shroud support is described. In the one embodiment, the annular forging also includes a top, cylindrical shaped end configured to be welded to one end of the pressure vessel cylindrical shell and a bottom, conical shaped end configured to be welded to the disk shaped bottom head. Reactor internal pump nozzles also are integrally formed in the annular forging. The nozzles do not include any internal or external projections. Stubs are formed in each nozzle opening to facilitate welding a pump housing to the forging. Also, an upper portion of each nozzle opening is configured to receive a portion of a diffuser coupled to a pump shaft which extends through the nozzle opening. Diffuser openings are formed in the integral pump deck to provide additional support for the pump impellers. The diffuser opening is sized so that a pump impeller can extend at least partially therethrough. The pump impeller is connected to the pump shaft which extends through the nozzle opening. 5 figs.

Inventors:
;
Issue Date:
Research Org.:
Advanced Reactor Corporation
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
570401
Patent Number(s):
5721758
Application Number:
PAN: 8-608,635; TRN: 98:003965
Assignee:
General Electric Co., Schenectady, NY (United States)
DOE Contract Number:  
FC02-92NE34267
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 24 Feb 1998
Country of Publication:
United States
Language:
English
Subject:
21 NUCLEAR POWER REACTORS AND ASSOCIATED PLANTS; BWR TYPE REACTORS; REACTOR COMPONENTS; PRESSURE VESSELS; SHROUDS; ANNULAR SPACE; NOZZLES; DESIGN; PUMPS

Citation Formats

Fife, A B, and Ballas, G J. Bottom head to shell junction assembly for a boiling water nuclear reactor. United States: N. p., 1998. Web.
Fife, A B, & Ballas, G J. Bottom head to shell junction assembly for a boiling water nuclear reactor. United States.
Fife, A B, and Ballas, G J. Tue . "Bottom head to shell junction assembly for a boiling water nuclear reactor". United States.
@article{osti_570401,
title = {Bottom head to shell junction assembly for a boiling water nuclear reactor},
author = {Fife, A B and Ballas, G J},
abstractNote = {A bottom head to shell junction assembly which, in one embodiment, includes an annular forging having an integrally formed pump deck and shroud support is described. In the one embodiment, the annular forging also includes a top, cylindrical shaped end configured to be welded to one end of the pressure vessel cylindrical shell and a bottom, conical shaped end configured to be welded to the disk shaped bottom head. Reactor internal pump nozzles also are integrally formed in the annular forging. The nozzles do not include any internal or external projections. Stubs are formed in each nozzle opening to facilitate welding a pump housing to the forging. Also, an upper portion of each nozzle opening is configured to receive a portion of a diffuser coupled to a pump shaft which extends through the nozzle opening. Diffuser openings are formed in the integral pump deck to provide additional support for the pump impellers. The diffuser opening is sized so that a pump impeller can extend at least partially therethrough. The pump impeller is connected to the pump shaft which extends through the nozzle opening. 5 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Feb 24 00:00:00 EST 1998},
month = {Tue Feb 24 00:00:00 EST 1998}
}

Patent:
Search for the full text at the U.S. Patent and Trademark Office Note: You will be redirected to the USPTO site, which may require a pop-up blocker to be deactivated to view the patent. If so, you will need to manually turn off your browser's pop-up blocker, typically found within the browser settings. (See DOE Patents FAQs for more information.)

Save / Share: