Title: Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly

Abstract

A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

Inventors:

Takken, Todd E.; Zhang, Xin; Yao, Yuan; Ferencz, Andrew

Issue Date:

Tue Jun 01 00:00:00 EDT 2021

Research Org.:

International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1824033

Patent Number(s):

11026326

Application Number:

16/528,908

Assignee:

International Business Machines Corporation (Armonk, NY)

Patent Classifications (CPCs):

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K1/0298 - {Multilayer circuits}
H05K1/117 - {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors}
H05K13/04 - Mounting of components {, e.g. of leadless components}
H05K2201/09145 - Edge details
H05K2201/0919 - Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
H05K3/366 - {substantially perpendicularly to each other
H05K3/403 - {Edge contacts

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DOE Contract Number:  

B621073

Resource Type:

Patent

Resource Relation:

Patent File Date: 08/01/2019

Country of Publication:

United States

Language:

English