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Title: Method of making thermally removable adhesives

Abstract

A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90.degree. C. to form a homogeneous solution, which, when cooled to less than approximately 70.degree. C., simultaneously initiates a Diels-Alder reaction between the furan and the bismaleimide and a epoxy curing reaction between the amine curative and the oxirane group to form a thermally-removable adhesive. Subsequent heating to a temperature greater than approximately 100.degree. C. causes the adhesive to melt and allows separation of adhered pieces.

Inventors:
Issue Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175159
Patent Number(s):
6825315
Application Number:
10/036,660
Assignee:
Sandia Corporation
Patent Classifications (CPCs):
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08G - MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
C - CHEMISTRY C09 - DYES C09J - ADHESIVES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Aubert, James H. Method of making thermally removable adhesives. United States: N. p., 2004. Web.
Aubert, James H. Method of making thermally removable adhesives. United States.
Aubert, James H. Tue . "Method of making thermally removable adhesives". United States. https://www.osti.gov/servlets/purl/1175159.
@article{osti_1175159,
title = {Method of making thermally removable adhesives},
author = {Aubert, James H.},
abstractNote = {A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90.degree. C. to form a homogeneous solution, which, when cooled to less than approximately 70.degree. C., simultaneously initiates a Diels-Alder reaction between the furan and the bismaleimide and a epoxy curing reaction between the amine curative and the oxirane group to form a thermally-removable adhesive. Subsequent heating to a temperature greater than approximately 100.degree. C. causes the adhesive to melt and allows separation of adhered pieces.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 30 00:00:00 EST 2004},
month = {Tue Nov 30 00:00:00 EST 2004}
}

Works referenced in this record:

A Theoretical Study of Curing Reactions of Maleimide Resins through Michael Additions of Amines
journal, March 2000