Method of making thermally removable adhesives
Abstract
A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90.degree. C. to form a homogeneous solution, which, when cooled to less than approximately 70.degree. C., simultaneously initiates a Diels-Alder reaction between the furan and the bismaleimide and a epoxy curing reaction between the amine curative and the oxirane group to form a thermally-removable adhesive. Subsequent heating to a temperature greater than approximately 100.degree. C. causes the adhesive to melt and allows separation of adhered pieces.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1175159
- Patent Number(s):
- 6825315
- Application Number:
- 10/036,660
- Assignee:
- Sandia Corporation
- Patent Classifications (CPCs):
-
C - CHEMISTRY C08 - ORGANIC MACROMOLECULAR COMPOUNDS C08G - MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
C - CHEMISTRY C09 - DYES C09J - ADHESIVES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Aubert, James H. Method of making thermally removable adhesives. United States: N. p., 2004.
Web.
Aubert, James H. Method of making thermally removable adhesives. United States.
Aubert, James H. Tue .
"Method of making thermally removable adhesives". United States. https://www.osti.gov/servlets/purl/1175159.
@article{osti_1175159,
title = {Method of making thermally removable adhesives},
author = {Aubert, James H.},
abstractNote = {A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90.degree. C. to form a homogeneous solution, which, when cooled to less than approximately 70.degree. C., simultaneously initiates a Diels-Alder reaction between the furan and the bismaleimide and a epoxy curing reaction between the amine curative and the oxirane group to form a thermally-removable adhesive. Subsequent heating to a temperature greater than approximately 100.degree. C. causes the adhesive to melt and allows separation of adhered pieces.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 30 00:00:00 EST 2004},
month = {Tue Nov 30 00:00:00 EST 2004}
}
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Works referenced in this record:
A Theoretical Study of Curing Reactions of Maleimide Resins through Michael Additions of Amines
journal, March 2000
- Okumoto, Satoshi; Yamabe, Shinichi
- The Journal of Organic Chemistry, Vol. 65, Issue 5