High performance thermoelectric nanocomposite device
Abstract
A thermoelectric device includes a nanocomposite material with nanowires of at least one thermoelectric material having a predetermined figure of merit, the nanowires being formed in a porous substrate having a low thermal conductivity and having an average pore diameter ranging from about 4 nm to about 300 nm.
- Inventors:
-
- Lakeshore, CA
- Birmingham, MI
- Issue Date:
- Research Org.:
- GM Global Technology Operations LLC (Detroit, MI)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1028490
- Patent Number(s):
- 8044293
- Application Number:
- 11/354,685
- Assignee:
- GM Global Technology Operations LLC (Detroit, MI)
- DOE Contract Number:
- FC26-04NT42278
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 77 NANOSCIENCE AND NANOTECHNOLOGY
Citation Formats
Yang, Jihui, and Snyder, Dexter D. High performance thermoelectric nanocomposite device. United States: N. p., 2011.
Web.
Yang, Jihui, & Snyder, Dexter D. High performance thermoelectric nanocomposite device. United States.
Yang, Jihui, and Snyder, Dexter D. Tue .
"High performance thermoelectric nanocomposite device". United States. https://www.osti.gov/servlets/purl/1028490.
@article{osti_1028490,
title = {High performance thermoelectric nanocomposite device},
author = {Yang, Jihui and Snyder, Dexter D},
abstractNote = {A thermoelectric device includes a nanocomposite material with nanowires of at least one thermoelectric material having a predetermined figure of merit, the nanowires being formed in a porous substrate having a low thermal conductivity and having an average pore diameter ranging from about 4 nm to about 300 nm.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 25 00:00:00 EDT 2011},
month = {Tue Oct 25 00:00:00 EDT 2011}
}
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Works referenced in this record:
Thermoelectric Power of Bismuth Nanocomposites
journal, May 2002
- Heremans, Joseph P.; Thrush, Christopher M.; Morelli, Donald T.
- Physical Review Letters, Vol. 88, Issue 21