Processing a printed wiring board by single bath electrodeposition

Meltzer, Michael P; Steffani, Christopher P; Gonfiotti, Ray A

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Title: Processing a printed wiring board by single bath electrodeposition

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Abstract

A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

Inventors:

Meltzer, Michael P ^[1]; Steffani, Christopher P ^[2]; Gonfiotti, Ray A ^[2]

Oakland, CA
Livermore, CA

Issue Date:: Tue Dec 07 00:00:00 EST 2010

Research Org.:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1011445

Patent Number(s):: 7846317

Application Number:: 10/373,350

Assignee:: Lawrence Livermore National Security, LLC (Livermore, CA)

Patent Classifications (CPCs):: C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D3/562 - {containing more than 50% by weight of iron or nickel or cobalt
C25D3/58 - containing more than 50% by weight of copper
C25D5/12 - at least one layer being of nickel or chromium

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K3/062 - {consisting of metals or alloys or metallic inorganic compounds
H05K3/244 - {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/24917 - including metal layer

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DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Citation Formats


                    Meltzer, Michael P, Steffani, Christopher P, and Gonfiotti, Ray A. Processing a printed wiring board by single bath electrodeposition.  United States: N. p., 2010. 
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                    Meltzer, Michael P, Steffani, Christopher P, & Gonfiotti, Ray A. Processing a printed wiring board by single bath electrodeposition.  United States.

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                    Meltzer, Michael P, Steffani, Christopher P, and Gonfiotti, Ray A. Tue .  
        "Processing a printed wiring board by single bath electrodeposition".  United States.  https://www.osti.gov/servlets/purl/1011445.

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@article{osti_1011445,

  title        = {Processing a printed wiring board by single bath electrodeposition},

  author       = {Meltzer, Michael P and Steffani, Christopher P and Gonfiotti, Ray A},

  abstractNote = {A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Dec 07 00:00:00 EST 2010},

  month        = {Tue Dec 07 00:00:00 EST 2010}

}

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Processing A Printed Wiring Board By Single Bath Electrodeposition

Patent Meltzer, Michael P [Oakland, CA]; Steffani, Christopher P [Livermore, CA]; Gonfiotti, Ray A [Livermore, CA]

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