3 pp.
3 pp.
| 98 K 3 pp. | |
| View Document | ||
| Title | Getting the Lead Out | |
| Author(s) | Gibson, Kerry | |
| Publication Date | April 08, 2011 | |
| Unique Identifier | ACC0400 | |
| Research Org | Ames Laboratory, Ames, IA | |
| Sponsoring Org | U.S. Department of Energy (DOE) Office of Science (SC), Office of Basic Energy Sciences (BES) | |
| Other Information | Related Patents: US 5,527,628 Pb-free Sn-Ag-Cu ternary eutectic solder; US 6,231,691 Lead-free solder | |
| Keywords | solder, lead, electronic waste, tin, eutectic alloy | |
| Abstract | Discarded electronics no longer pose an environmental hazard from lead solder thanks to a lead-free alternative developed at the Ames Laboratory. | |
| 98 K 3 pp. | |
| View Document | ||
