Assessment of NiPd finished components for surface mount assembly applications

Conference · Tue Aug 01 00:00:00 EDT 1995

OSTI ID:97273

Finley, D W; Ray, U; Artaki, I ^[1]; Vianco, P ^[2]; Shah, S; Reyes, A; Haq, M ^[3]

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1. AT and T Bell Laboratories, Princeton, NJ (United States)
2. Sandia National Labs., Albuquerque, NM (United States)
3. AMD Incorporated, Santa Clara, CA (United States)

Recent trends towards finer pitch devices and assembly with lead free solders have resulted in increased interest in NiPd plated component leads by the electronics industry. This paper discusses the performance of NiPd fine pitch components as determined by wettability, assembly performance and solder joint reliability. Assembly evaluations were performed with a lead free solder as well as with eutectic SnPb solder. The compatibility of the NiPd component leads with different circuit board finishes (metallic and organic azole) will also be discussed.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 97273
• Report Number(s): SAND-95-1639C; CONF-9508140-2; ON: DE95015774
• Resource Relation: Conference: Surface mount international conference, San Jose, CA (United States), 27-31 Aug 1995; Other Information: PBD: [1995]
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES
36 MATERIALS SCIENCE
METALLURGICAL FLUX
MATERIALS TESTING
INTEGRATED CIRCUITS
SOLDERING
NICKEL ALLOYS
PALLADIUM ALLOYS
WETTABILITY
SOLDERED JOINTS
LEAD ALLOYS
TIN BASE ALLOYS
COATINGS
MECHANICAL PROPERTIES