Method of making cascaded die mountings with springs-loaded contact-bond options
Patent
·
OSTI ID:909707
- Oak Ridge, TN
- Knoxville, TN
- Kingston, TN
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
- Research Organization:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-00OR22725
- Assignee:
- UT-Battelle, LLC (Oak Ridge, TN)
- Patent Number(s):
- 7,232,710
- Application Number:
- 11/119,328
- OSTI ID:
- 909707
- Country of Publication:
- United States
- Language:
- English
Dimple-array interconnect technique for packaging power semiconductor devices and modules
|
conference | |
Integrated Flip-Chip Flex-Circuit Packaging for Power Electronics Applications
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journal | March 2004 |
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