Method of depositing buffer layers on biaxially textured metal substrates

Beach, David B; Morrell, Jonathan S; Paranthaman, Mariappan; Chirayil, Thomas; Specht, Eliot D; Goyal, Amit

Title: Method of depositing buffer layers on biaxially textured metal substrates

Patent · Tue Jan 01 00:00:00 EST 2002

OSTI ID:874680

Beach, David B ^[1]; Morrell, Jonathan S ^[1]; Paranthaman, Mariappan ^[1]; Chirayil, Thomas ^[1]; Specht, Eliot D ^[1]; Goyal, Amit ^[1]

Knoxville, TN

A laminate article comprises a substrate and a biaxially textured (RE.sup.1.sub.x RE.sup.2.sub.(1-x)).sub.2 O.sub.3 buffer layer over the substrate, wherein 0<1 and RE.sup.1 and RE.sup.2 are each selected from the group consisting of Nd, Sm, Eu, Ho, Er, Lu, Gd, Tb, Dy, Tm, and Yb. The (RE.sup.1.sub.x RE.sup.2.sub.(1-x)).sub.2 O.sub.3 buffer layer can be deposited using sol-gel or metal-organic decomposition. The laminate article can include a layer of YBCO over the (RE.sup.1.sub.x RE.sup.2.sub.(1-x)).sub.2 O.sub.3 buffer layer. A layer of CeO.sub.2 between the YBCO layer and the (RE.sup.1.sub.x RE.sup.2.sub.(1-x)).sub.2 O.sub.3 buffer can also be include. Further included can be a layer of YSZ between the CeO.sub.2 layer and the (RE.sup.1.sub.x RE.sup.2.sub.(1-x)).sub.2 O.sub.3 buffer layer. The substrate can be a biaxially textured metal, such as nickel. A method of forming the laminate article is also disclosed.

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Research Organization:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

DOE Contract Number:: AC05-96OR22464

Assignee:: UT-Battelle, LLC (Oak Ridge, TN)

Patent Number(s):: US 6440211

Application Number:: 09/409120

OSTI ID:: 874680

Country of Publication:: United States

Language:: English

References (9)

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High critical current density superconducting tapes by epitaxial deposition of YBa₂Cu₃O_x thick films on biaxially textured metals Goyal, A.; Norton, D. P.; Budai, J. D. Applied Physics Letters, Vol. 69, Issue 12, p. 1795-1797 https://doi.org/10.1063/1.117489	journal	September 1996
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buffer
layers
biaxially
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metal
substrates
laminate
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resup1subx
resup2sub1-xsub2
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layer
0<1
resup1
resup2
selected
consisting
eu
gd
tb
tm
deposited
sol-gel
metal-organic
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ybco
ceosub2
included
ysz
nickel
forming
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metal substrate
textured metal
/117/427/428/

Title: Method of depositing buffer layers on biaxially textured metal substrates

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References (9)

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