Layer growth in Au--Pb/In solder joints
The solid state reaction between a Pb-In solder alloy and thin film Au has been investigated at ten aging temperatures ranging from 70 to 170/sup 0/C. Also, bulk Au-solder samples were aged at 150/sup 0/C for metallographic analysis. No significant difference was found between the aging behavior of thin and bulk Au specimens. A thin single phase layer of Au/sub 9/In/sub 4/ was found adjacent to Au while a thick two-phase layer of AuIn/sub 2/ and Pb was found between Au/sub 9/In/sub 4/ and solder. The Pb phase was shown to have considerable mobility and able to ripen at room temperature. Peculiar planar interface instabilities and voids in the Au-Au/sub 9/In/sub 4/ interface were found. Although the total layer thickness vs aging time data could be closely fitted with a power law relationship, it was shown that a linear relationship also fits well and is consistent with accepted metallurgical concepts. An activation energy of 0.61 eV was found by regression analysis of the intermetallic growth kinetics.
- Research Organization:
- Sandia Labs., Albuquerque, NM
- OSTI ID:
- 7321949
- Journal Information:
- Metall. Trans., A; (United States), Vol. 7:8
- Country of Publication:
- United States
- Language:
- English
Similar Records
Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging
An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.
Related Subjects
GOLD ALLOYS
PHASE STUDIES
INDIUM ALLOYS
LEAD ALLOYS
ACTIVATION ENERGY
AGING
FILMS
HIGH TEMPERATURE
INTERMETALLIC COMPOUNDS
LAYERS
MEDIUM TEMPERATURE
SOLDERED JOINTS
TERNARY ALLOY SYSTEMS
ALLOY SYSTEMS
ALLOYS
ENERGY
JOINTS
360102* - Metals & Alloys- Structure & Phase Studies