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Title: Microfabrication processes for high-T sub c superconducting films

Journal Article · · IEEE Transactions on Components, Hybrids, and Manufacturing Technology (Institute of Electrical and Electronics Engineers); (USA)
DOI:https://doi.org/10.1109/33.49014· OSTI ID:7051998
; ;  [1]
  1. NEC Corp., 34, Miyukigaoka, Tsukuba, Ibaraki (JP)

Microfabrication processes for Y-Ba-Cu-O films have been investigated, using ion-beam techniques. High-{Tc} superconducting lines as narrow as 0.8 {mu}m have been fabricated from epitaxial YBa{sub 2}Cu{sub 3}O{sub 7 {minus} {ital y}} films by Ar ion-beam etching (IBE), combined with focused ion-beam (FIB) lithography. The resulting lines, 1.3 {mu}m wide and 2 mm long, showed a zero resistance temperature of 81 K and a critical current density of 1.9 {times} 10{sup 4} A/cm{sup 2} at 77.3 K. Maskless etching was carried out using 130-keV au{sup +} focused ion-beam (FIB) with a 0.1-{mu}m-diameter beam. A 50-nm-thick film was patterned into 0.3-{mu}m-wide lines at a dose of 5 {times} {sup 16} ions/cm{sup 2}. In comparison with Ar IBE, Cl{sub 2} reactive ion-beam etching (RIBE) exhibited an enhancement effect in sputtering yield. Ion implantation with 300-keV Si{sup + +} FIB also indicated the possibility to produce submicrometer patterns by selectively modifying film properties from superconductive to normal or insulting.

OSTI ID:
7051998
Journal Information:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology (Institute of Electrical and Electronics Engineers); (USA), Vol. 12:4; ISSN 0148-6411
Country of Publication:
United States
Language:
English