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Title: Ion-bombardment-enhanced plasma etching of tungsten with NF/sub 3//O/sub 2/

Journal Article · · J. Vac. Sci. Technol., B; (United States)
DOI:https://doi.org/10.1116/1.584216· OSTI ID:6791137

Ions and neutrals sampled from a NF/sub 3//O/sub 2/ etching plasma were observed by a quadrupole mass spectrometer and cylindrical mirror ion energy analyzer to investigate ion-bombardment-enhanced etching of tungsten. Dc biasing of a 13.56 MHz, 2.7 Pa, 1.24 W/cm/sup 2/ , 3/1 NF/sub 3//O/sub 2/ glow discharge raised the average ion energy bombarding the grounded electrode from 35 to 172 eV concurrent with an increase in the ion current by a factor of 3. Total conversion of NF/sub 3/ to N/sub 2/ and F/sub 2/ occurred under these conditions yielding a typical etch rate of polycrystalline tungsten of 150 nm/min. The primary ion observed was WF/sup +//sub 5/. The WF/sub 6/ etch product concentration was independent of ion energy, but correlated strongly with ion current. The results support a damage-induced chemical reaction as the enhancement mechanism.

Research Organization:
Department of Chemical Engineering, University of California, Berkeley, California 94720
OSTI ID:
6791137
Journal Information:
J. Vac. Sci. Technol., B; (United States), Vol. 6:5
Country of Publication:
United States
Language:
English