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Title: Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same

Patent ·
OSTI ID:6672881

An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.

Assignee:
Dept. of Energy
Patent Number(s):
US 4431862
OSTI ID:
6672881
Resource Relation:
Patent File Date: Filed date 15 Mar 1982; Other Information: PAT-APPL-358083
Country of Publication:
United States
Language:
English