Methods for patterned deposition on a substrate
A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto. 5 figures.
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- Sandia Corporation, Albuquerque, NM (United States)
- Patent Number(s):
- US 5380474; A
- Application Number:
- PPN: US 8-065211
- OSTI ID:
- 6666135
- Resource Relation:
- Patent File Date: 20 May 1993
- Country of Publication:
- United States
- Language:
- English
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