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Title: Nickel/indium alloy and method of using same in the manufacture of printed circuit boards

Patent ·
OSTI ID:6098125

This patent describes an improved method of preparing a printed circuit board from a metal clad substrate which comprises: (a) covering at least one of the surfaces of the metal clad substrate with a coating of photoresist; (b) masking the photoresist with a predetermined circuit design image; (c) exposing the photoresist to a source of energy to provide a resist layer portion susceptible to a etchant over a desired circuit image on at least one of the surfaces, and a resist layer portion resistant to the etchant over the remainder of the surfaces; (d) removing those portions of the photoresist which are susceptible to the etchant to provide the desired circuit image on at least one of the surfaces of the metal cladding; (e) electroplating the desired circuit image with a metallic etch resist; (f) removing the remaining portions of the photoresist from the board exposing a portion of the metal cladding; and (g) removing the exposed metal cladding from the board to provide a board having metal circuit covered by a metallic etch resist, the improvement comprising a metallic etch resist composed of a nickel/indium alloy containing from about 0.1 to about 10 weight percent indium based on the total weight of the alloy.

Assignee:
Allied Corp., Morris Township, Morris County, NJ
Patent Number(s):
US 4686015
OSTI ID:
6098125
Resource Relation:
Patent File Date: Filed date 19 Jun 1986
Country of Publication:
United States
Language:
English