Microprocessor controlled temperature chassis. Final report
The objective of the microprocessor-controlled temperature chassis was to control temperature more reliably than the existing system and to be flexible and general-purpose enough to support many temperature-controlling needs. For the evaluation of the chassis, an HMC thermal chuck was controlled. It was found that this chuck could be quickly brought to temperature and maintained within one degree Celcius. The accuracy and flexibility of the system was achieved by the use of a microprocessor which is much more powerful than discrete hardware. The hardwre for the chassis is configured in three blocks: control, interface, and feedback. The software was written in Intel 8085 assembly language, then downloaded into ROMs contained on the microprocessor board.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5984543
- Report Number(s):
- BDX-613-3172; ON: DE85008392; TRN: 85-007838
- Country of Publication:
- United States
- Language:
- English
Similar Records
A microprocessor multi-task monitor
Mold heating and cooling microprocessor conversion. Final report