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Title: Gamma-ray irradiation effects on VLSI geometry MOSFETs fabricated on laser recrystallized SOI wafers

Journal Article · · IEEE Trans. Nucl. Sci.; (United States)

The authors have investigated the effects of radiation on the characteristics of NMOS and PMOS FETs having different channel length (1.3 ..mu.. m - 5 ..mu.. m). The FETs were fabricated on SOI wafers where the silicon (0.5 ..mu.. m) film was laser recrystallized. Gammairradiation (up to 200 Krad(Si)) was performed at 300 K while the devices were under bias (+10, 0, -10 volts). Radiation produced severe increases in the NMOS FETs subthreshold leakage currents. Smaller increases with irradiation were observed in the PMOS FET/sup 0/s subthreshold leakage currents. Radiation caused increases in the PMOS FET/sup 0/s threshold voltage with the largest shifts occuring for the +10 volts gate bias. The threshold voltage in NMOS devices decreased with exposure to ionizing irradiation. All the observed threshold shifts are consistent with net hole trapping in the SiO/sub 2/. The authors observed a monotonic dependence of the radiation induced threshold voltage shifts on the channel length of PMOS devices. Smaller threshold shifts were obtained for the shorter channel devices.

Research Organization:
Westinghouse Electric Corp., Advanced Technology Labs., P.O.B. 1521 MS 3531, Baltimore, MD 21205
OSTI ID:
5922155
Journal Information:
IEEE Trans. Nucl. Sci.; (United States), Vol. 29:6
Country of Publication:
United States
Language:
English