Performance of a wide-field flux delivery system for synchrotron x-ray lithography

Journal Article · Mon Nov 01 00:00:00 EST 1993 · Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States)

DOI:https://doi.org/10.1116/1.586571· OSTI ID:5649577

Silverman, J P ^[1]; Archie, C N; Oberschmidt, J M; Rippstein, R P ^[2]

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1. IBM Semiconductor Research and Development Center, Yorktown Heights, New York 10598 (United States)
2. IBM Semiconductor Research and Development Center, Hopewell Junction, New York 12533 (United States)

An x-ray flux delivery system consisting of a compact storage ring and dedicated beamlines is now in routine use in the IBM Advanced Lithography Facility in East Fishkill, New York. The beamlines have been designed for use with a stepper that scans the mask and wafer vertically through a stationary beam. The performance of the system from a lithographic standpoint is reported. The measured size and stability of the synchrotron x-ray source will be presented, and the design and performance of the beamlines will be discussed. The beamlines have been designed to provide high intensity, uniform illumination over a wide field. The overall performance of the system has been evaluated by measuring the flux at the mask plane in the stepper. A horizontal uniformity of better than [plus minus]2% over a field more than 50 mm wide has been achieved; the vertical uniformity is limited by the uniformity of the stepper scanning mechanism. The delivered mask-incident flux per milliampere of stored beam current has been found to be 1.5 mW/(mA cm), approximately four times greater than obtained with a simple planar mirror. A 100 mJ/cm[sup 2] resist with a mask transmission of 50% therefore requires a less than 2 s exposure (plus overscan overhead) for a 2.5 cm high field at a typical stored current of 200 mA, independent of the field width (up to the maximum of more than 50 mm). In addition, the source has proved itself to be highly reliable, with beam available for 99% of the scheduled time over the most recent seven month period.

• OSTI ID: 5649577
• Journal Information: Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States), Vol. 11:6; ISSN 0734-211X
• Country of Publication: United States
• Language: English

Related Subjects

43 PARTICLE ACCELERATORS
SYNCHROTRON RADIATION
BEAM TRANSPORT
X-RAY SOURCES
PERFORMANCE TESTING
RADIATION FLUX
STORAGE RINGS
BREMSSTRAHLUNG
ELECTROMAGNETIC RADIATION
EQUIPMENT
RADIATION SOURCES
RADIATIONS
TESTING
X-RAY EQUIPMENT
430303* - Particle Accelerators- Experimental Facilities & Equipment
430200 - Particle Accelerators- Beam Dynamics
Field Calculations
& Ion Optics