Thin film network test pattern for use with electroplated gold

Conference · Sun Nov 01 00:00:00 EST 1981

OSTI ID:5582180

Hines, R A

A test pattern was developed to monitor the quality of pattern electroplated gold thin-film networks (TFNs). A Ti/Pd/pattern electroplated Au metallization system is replacing the current Bendix Kansas City production evaporated Cr/Au system. The monitor retains the most useful features of its predecessor and adds several new patterns for the electrical measurement of resolution, gold thickness, and conductor width. Each 0.25 by 1 in. monitor contains standard and checkerboard thermal compression lead frame bond pads and 18 electrical test patterns. Pattern electroplating was used to make a conductor for 4-point resistance measurements on the monitor and a microcomputer based tester is being assembled to measure and reduce the resistance data.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5582180
• Report Number(s): BDX-613-2712; CONF-820214-1; ON: DE82010728
• Resource Relation: Conference: 9. plating in electronic industry symposium, Atlanta, GA, USA, 16 Feb 1982
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
ELECTRIC CONTACTS
QUALITY CONTROL
MICROELECTRONIC CIRCUITS
BONDING
CHROMIUM
ELECTRIC CONDUCTIVITY
ELECTRODEPOSITED COATINGS
GOLD
PRODUCTION
THICKNESS
COATINGS
CONTROL
DIMENSIONS
ELECTRICAL EQUIPMENT
ELECTRICAL PROPERTIES
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
FABRICATION
JOINING
METALS
PHYSICAL PROPERTIES
TRANSITION ELEMENTS
420800* - Engineering- Electronic Circuits & Devices- (-1989)