skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Grain elongation and anisotropic grain growth during superplastic deformation in an Al-Mg-Mn-Cu alloy

Journal Article · · Acta Materialia
; ;  [1]
  1. Univ. of Michigan, Ann Arbor, MI (United States). Dept. of Materials Science and Engineering

Evolution of grain morphology in a fine grained Al-Mg-Mn-Cu alloy during uniaxial superplastic deformation is studied quantitatively. Grains undergo elongation, as well as dynamic grain growth along all directions, the separation and analysis of which is attempted here. Based on such analysis, the computed true grain growth rate along directions transverse to the tensile axis are found to exceed that parallel to the tensile axis. Possible mechanisms for this new observation are suggested. A unique relationship between grain boundary sliding rate and dynamic grain growth rate is found at different applied strain rates; this indicates that grain boundary sliding and grain boundary migration rates are inherently connected through the same mechanism.

OSTI ID:
540964
Journal Information:
Acta Materialia, Vol. 45, Issue 9; Other Information: PBD: Sep 1997
Country of Publication:
United States
Language:
English

Similar Records

The absence of relative grain translation during superplastic deformation of an Al-Li-Mg-Cu-Zr alloy
Journal Article · Sat May 01 00:00:00 EDT 1993 · Metallurgical Transactions, A (Physical Metallurgy and Materials Science); (United States) · OSTI ID:540964

Observations of grain-boundary sliding and surface topography in an 8090 Al alloy after uniaxial and biaxial superplastic deformation
Journal Article · Fri Jan 01 00:00:00 EST 1999 · Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science · OSTI ID:540964

On the microstructural aspects of the nonhomogeneity of superplastic deformation at the level of grain groups
Journal Article · Sat Jan 01 00:00:00 EST 1994 · Acta Metallurgica et Materialia · OSTI ID:540964