skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Bulk acceptor compensation produced in p-type silicon at near-ambient temperatures by a H/sub 2/O plasma

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.94849· OSTI ID:5171268

We report the neutralization of the shallow acceptors boron and gallium in p-type silicon to a depth >1 ..mu..m after exposure to a H/sub 2/O plasma for 3 h at temperatures as low as 80 /sup 0/C. The fact that uncompensated n-type silicon is unaffected by the plasma treatment means that donor formation is excluded. Exposure to either O/sub 2/ or H/sub 2/ plasmas does not lead to acceptor removal; however, sequential treatment in an O/sub 2/ plasma followed by a H/sub 2/ plasma produces the same effect as the H/sub 2/O plasma while the inverse sequence has no effect. Our observations can be explained with a model considering rapidly diffusing atomic oxygen and hydrogen which recombine on acceptor sites forming neutral A/sup -/OH/sup +/ complexes. The model shows that acceptor compensation kinetics is dominated by the diffusion of atomic hydrogen.

Research Organization:
Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, Berkeley, California 94720
DOE Contract Number:
AC03-76SF00098
OSTI ID:
5171268
Journal Information:
Appl. Phys. Lett.; (United States), Vol. 44:6
Country of Publication:
United States
Language:
English