Analysis and computation of conjugate heat transfer in trapezoidal microchannel heat sinks in a silicon substrate
- Univ. of South Florida, Tampa, FL (United States). Dept. of Mechanical Engineering
The hydrodynamically and thermally developing laminar flow and heat transfer processes in microchannel cooling passages in the silicon substrate of a high-heat-flux electronic device is numerically investigated. The device is modeled exactly considering local heat generation in circuit components, conduction of heat through the solid structure, and convection of heat in the coolant. The fluid flow and heat transfer model is developed for trapezoidal channel to account for devices fabricated using silicon <100>. The numerical model is developed using a body-fitted curvilinear coordinate system where boundaries of grid cells are aligned to solid-fluid interfaces including the inclined side walls of microchannels. The transport equations are discretized using the control volume formulation along with hybrid differencing to adequately account for convective and diffusive transports. The energy equation is solved in a whole-field manner, using the harmonic mean of solid and fluid thermal conductivities for the interface. The computed results includes the velocity field in the fluid, the temperature distribution in the solid and fluid and the spatial distribution of the Nusselt number. The objective of the study is to determine the effects of the channel aspect ratio, channel spacing, Reynolds number variations, and heat source location on the hydraulic and thermal performance of the device. The results suggest a better thermal performance for the rectangular channel when compared with trapezoidal geometry and the existence of an optimum channel geometry for a given operational conditions. The results of this study are expected to be extremely useful for the design and fabrication of microchannel cooling systems.
- OSTI ID:
- 516824
- Report Number(s):
- CONF-950828-; ISBN 0-7918-1704-0; TRN: IM9738%%134
- Resource Relation:
- Conference: 1995 National heat transfer conference, Portland, OR (United States), 5-9 Aug 1995; Other Information: PBD: 1995; Related Information: Is Part Of 1995 national heat transfer conference: Proceedings. Volume 3; HTD-Volume 305; Sadhal, S.S. [ed.] [Univ. of Southern California, Los Angeles, CA (United States)]; Gopinath, A. [ed.] [Naval Postgraduate School, Monterey, CA (United States)]; Oosthuizen, P.H. [ed.] [Queens Univ., Kingston, Ontario (Canada)]; Hashemi, A. [ed.]; PB: 199 p.
- Country of Publication:
- United States
- Language:
- English
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