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Title: Adhesive properties of urethane resin

Journal Article · · SAMPE Q.; (United States)
OSTI ID:5000057

The adhesive and bulk properties of a polyol cured methylene diphenyl diisocyanate (MDI) urethane resin being evaluated as a replacement for a MOCA cured urethane resin system are described. To verify that the adhesive aging studies do describe interfacial rather than bulk phenomena, shear moduli of the bulk resin system were studied with and without aging. The adhesive strength properties were evaluated at room temperature with and without aging at 74/sup 0/C and at constant high humidity with thermal cycling. In addition, the durability of the bond is evaluated with and without the addition of an epoxy terminated silane primer. (auth)

Research Organization:
Sandia Labs., Albuquerque, NM
OSTI ID:
5000057
Journal Information:
SAMPE Q.; (United States), Vol. 6:4
Country of Publication:
United States
Language:
English