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Title: SOLDERING OF ALUMINUM BASE METALS

Patent ·
OSTI ID:4343443

This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.

Research Organization:
Originating Research Org. not identified
NSA Number:
NSA-12-010251
Assignee:
U.S. Atomic Energy Commission
Patent Number(s):
US 2824365
OSTI ID:
4343443
Resource Relation:
Other Information: Orig. Receipt Date: 31-DEC-58
Country of Publication:
United States
Language:
English

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