SOLDERING OF ALUMINUM BASE METALS
Patent
·
OSTI ID:4343443
This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.
- Research Organization:
- Originating Research Org. not identified
- NSA Number:
- NSA-12-010251
- Assignee:
- U.S. Atomic Energy Commission
- Patent Number(s):
- US 2824365
- OSTI ID:
- 4343443
- Resource Relation:
- Other Information: Orig. Receipt Date: 31-DEC-58
- Country of Publication:
- United States
- Language:
- English
Similar Records
Solder for oxide layer-building metals and alloys
Solder for oxide layer-building metals and alloys
SOLDER BONDING ALUMINUM TO URANIUM
Patent
·
Wed Jan 01 00:00:00 EST 1992
·
OSTI ID:4343443
Solder for oxide layer-building metals and alloys
Patent
·
Tue Sep 15 00:00:00 EDT 1992
·
OSTI ID:4343443
SOLDER BONDING ALUMINUM TO URANIUM
Journal Article
·
Mon Jun 01 00:00:00 EDT 1959
· Welding J. (N.Y.)
·
OSTI ID:4343443
+1 more