RELIABLE PARALLEL-GAP SOLDERING FOR SILICON INTEGRATED CIRCUIT FLAT PACKS.
Technical Report
·
OSTI ID:4177188
- Research Organization:
- Sandia Corp., Livermore, Calif.
- DOE Contract Number:
- AT(29-1)-789
- NSA Number:
- NSA-21-044992
- OSTI ID:
- 4177188
- Report Number(s):
- SCL-DR-67-75
- Resource Relation:
- Other Information: UNCL. Orig. Receipt Date: 31-DEC-67
- Country of Publication:
- United States
- Language:
- English
Similar Records
Hot-gas solder leveling on printed circuit boards
REQUIREMENTS FOR REFLOW SOLDERING OF INTEGRATED CIRCUIT FLATPACKS. Final Report.
A STUDY OF THE ACCURACY AND RELIABILITY OF COMPOUND CIRCUITS
Technical Report
·
Sat Dec 01 00:00:00 EST 1973
·
OSTI ID:4177188
REQUIREMENTS FOR REFLOW SOLDERING OF INTEGRATED CIRCUIT FLATPACKS. Final Report.
Technical Report
·
Fri Jan 01 00:00:00 EST 1971
·
OSTI ID:4177188
A STUDY OF THE ACCURACY AND RELIABILITY OF COMPOUND CIRCUITS
Technical Report
·
Tue May 13 00:00:00 EDT 1952
·
OSTI ID:4177188