Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime
Advanced packaging technologies are currently being designed and developed by the power electronics industry however, the maximum operating temperature is still limited to 175 degrees Celsius for the silicon carbide devices. Bonded materials such as sintered copper and polymeric materials are potential candidates for high temperature operation, but it is critical to characterize and evaluate its reliability under harsh operating conditions. In this project, we discuss the results of the accelerated experiments conducted on sintered copper and polymeric materials. Additionally, a novel framework to develop the lifetime prediction model of bonded interfaces through employing statistical and machine learning models are described. In this task, scanning acoustic microscope images of bonded interfaces obtained under thermal cycling experiments are used as the data.
- Research Organization:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- Sponsoring Organization:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE), Transportation Office. Vehicle Technologies Office
- DOE Contract Number:
- AC36-08GO28308
- OSTI ID:
- 2305396
- Report Number(s):
- NREL/PR-5400-85899; MainId:86672; UUID:609bfa5f-dd84-4876-9335-28b2575e68c0; MainAdminId:71783
- Resource Relation:
- Conference: Presented at the 2023 Vehicle Technologies Office Annual Merit Review, 12-15 June 2023
- Country of Publication:
- United States
- Language:
- English
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Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime
Power Electronics Materials and Bonded Interfaces - Reliability and LIfetime