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Title: Comparative electron spin resonance study of epi-Lu{sub 2}O{sub 3}/(111)Si and a-Lu{sub 2}O{sub 3}/(100)Si interfaces: Misfit point defects

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.3326516· OSTI ID:21476195
; ;  [1]; ; ;  [2]
  1. Department of Physics and Astronomy, University of Leuven, Celestijnenlaan 200D, 3001 Leuven (Belgium) and INPAC-Institute for Nanoscale Physics and Chemistry, University of Leuven, Celestijnenlaan, 200D Leuven (Belgium)
  2. Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853-1501 (United States)

An electron spin resonance study has been carried out on heteroepitaxial Si/insulator structures obtained through growth of epi-Lu{sub 2}O{sub 3} films on (111)Si ({approx}4.5% mismatch) by molecular-beam epitaxy, with special attention to the inherent quality as well as the thermal stability of interfaces, monitored through occurring paramagnetic point defects. This indicates the presence, in the as-grown state, of P{sub b} defects ({approx}5x10{sup 11} cm{sup -2}) with the unpaired sp{sup 3} Si dangling bond along the [111] interface normal, the archetypical defect (trap) of the standard thermal (111)Si/SiO{sub 2} interface, directly revealing, and identified as the result of, imperfect epitaxy. The occurrence of P{sub b} defects, a major system of electrically detrimental interface traps, is ascribed to lattice mismatch with related introduction of misfit dislocations. This interface nature appears to persist for annealing in vacuum up to a temperature T{sub an{approx}}420 deg. C. Yet, in the range T{sub an{approx}}420-550 deg. C, the interface starts to ''degrade'' to standard Si/SiO{sub 2} properties, as indicated by the gradually increasing P{sub b} density and attendant appearance of the EX center, an SiO{sub 2}-associated defect. At T{sub an{approx}}700 deg. C, [P{sub b}] has increased to about 1.3 times the value for standard thermal (111)Si/SiO{sub 2}, to remain constant up to T{sub an{approx}}1000 deg. C, indicative of an unaltered interface structure. Annealing at T{sub an}>1000 deg. C results in disintegration altogether of the Si/SiO{sub 2}-type interface. Passivation anneal in H{sub 2} (405 deg. C) alarmingly fails to deactivate the P{sub b} system to the device grade (sub) 10{sup 10} cm{sup -2} eV{sup -1} level, which would disfavor c-Lu{sub 2}O{sub 3} as a suitable future high-{kappa} replacement for the a-SiO{sub 2} gate dielectric. Comparison of the thermal stability of the c-Lu{sub 2}O{sub 3}/(111)Si interface with that of molecular-beam deposited amorphous-Lu{sub 2}O{sub 3}/(100)Si shows the former to be superior, yet unlikely to meet technological thermal budget requirements. No Lu{sub 2}O{sub 3}-specific point defects could be observed.

OSTI ID:
21476195
Journal Information:
Journal of Applied Physics, Vol. 107, Issue 9; Other Information: DOI: 10.1063/1.3326516; (c) 2010 American Institute of Physics; ISSN 0021-8979
Country of Publication:
United States
Language:
English