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Title: Effect of thermal annealing on charge exchange between oxygen interstitial defects within HfO{sub 2} and oxygen-deficient silicon centers within the SiO{sub 2}/Si interface

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.3122925· OSTI ID:21294050
;  [1];  [2]
  1. Department of Electrical and Computer Engineering and Plasma Processing and Technology Laboratory, University of Wisconsin-Madison, Madison, Wisconsin 53706 (United States)
  2. Stanford University, Stanford, California 94305 (United States)

We compare the charging response of rapid thermally annealed (800 and 1000 deg. C) 4 nm thick HfO{sub 2} to as-deposited HfO{sub 2} on Si by measuring the surface potential of the HfO{sub 2} layers after vacuum ultraviolet (VUV) irradiation with 11.6 eV photons. From VUV spectroscopy, we determined all HfO{sub 2} layers show the presence of oxygen-interstitial defects (OIDs). The electronic states of OID in HfO{sub 2} line up in energy with oxygen-deficient Si centers within the SiO{sub 2} interfacial layer. This implies charge exchange between OIDs within HfO{sub 2} and the O-deficient silicon centers within the SiO{sub 2} interfacial layer are very important for controlling the radiation-induced trapped charge in HfO{sub 2} dielectric stacks.

OSTI ID:
21294050
Journal Information:
Applied Physics Letters, Vol. 94, Issue 16; Other Information: DOI: 10.1063/1.3122925; (c) 2009 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English