Microstructural development inside the stress induced martensite variant in a Ti-Ni-Nb shape memory alloy

Journal Article · Mon Apr 03 00:00:00 EDT 2000 · Acta Materialia

DOI:https://doi.org/10.1016/S1359-6454(99)00391-2· OSTI ID:20020587

Zheng, Y F; Cai, W; Zhang, J X; Zhao, L C; Ye, H Q

The microstructural development inside the stress induced martensite (SIM) variants in Ti-Ni-Nb alloy with various degrees of deformation have been revealed by electron microscopic observations. The orientation relationship between the SIM and the parent phase has been found: [1{bar 1}0]{sub M}{parallel}[11{bar 1}]{sub B2}, (001){sub M} 5{degree} away from (101){sub B2}. The lattice invariant shear of the SIM variants at the slightly deformed stage is dominantly (11{bar 1}) Type I twin. Besides the ordinary slip, the adjustment and development of the internal secondary twinning from (11{bar 1}) Type I twin to {l_angle}011{r_angle} Type II/ or (011) Type I twin, (001)compound twin and (111) Type I twin happen concurrently or in combination inside the SIM variants with the further deformation. The corresponding deformation mechanisms include stress induced reorientation of SIM substructural bands by the most favorably oriented twin system, stress induced migration of the SIM substructural boundary through internal twinning and stress induced injection of foreign SIM variant to the preexisting substructural bands.

• Research Organization: Harbin Inst. of Tech. (CN)
• OSTI ID: 20020587
• Journal Information: Acta Materialia, Vol. 48, Issue 6; Other Information: PBD: 3 Apr 2000; ISSN 1359-6454
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
MICROSTRUCTURE
SHAPE MEMORY EFFECT
TITANIUM ALLOYS
NICKEL ALLOYS
NIOBIUM ALLOYS
MARTENSITE
ORIENTATION
TWINNING
INTERFACES
ELECTRON MICROSCOPY