Low-loss interconnects for modular superconducting quantum processors

Niu, Jingjing; Zhang, Libo; Liu, Yang; Qiu, Jiawei; Huang, Wenhui; Huang, Jiaxiang; Jia, Hao; Liu, Jiawei; Tao, Ziyu; Wei, Weiwei; Zhou, Yuxuan; Zou, Wanjing; Chen, Yuanzhen; Deng, Xiaowei; Deng, Xiuhao; Hu, Changkang; Hu, Ling; Li, Jian; Tan, Dian; Xu, Yuan; Yan, Fei; Yan, Tongxing; Liu, Song; Zhong, Youpeng; Cleland, Andrew N.; Yu, Dapeng

doi:10.1038/s41928-023-00925-z

Title: Low-loss interconnects for modular superconducting quantum processors

Journal Article · Thu Feb 16 00:00:00 EST 2023 · Nature Electronics

DOI:https://doi.org/10.1038/s41928-023-00925-z· OSTI ID:1989368

Niu, Jingjing ^[1]; Zhang, Libo ^[2]; Liu, Yang ^[2];

^[2]; Huang, Wenhui ^[2]; Huang, Jiaxiang ^[2]; Jia, Hao ^[2]; Liu, Jiawei ^[2];

^[2]; Wei, Weiwei ^[2]; Zhou, Yuxuan ^[2]; Zou, Wanjing ^[2]; Chen, Yuanzhen ^[2]; Deng, Xiaowei ^[2]; Deng, Xiuhao ^[2]; Hu, Changkang ^[2];

^[2];

^[2]; Tan, Dian ^[2];

^[1] more »

Southern University of Science and Technology (SUSTech), Shenzhen (China); International Quantum Academy, Shenzhen (China); Hefei National Laboratory, Shenzhen (China)
Southern University of Science and Technology (SUSTech), Shenzhen (China); International Quantum Academy, Shenzhen (China)
Univ. of Chicago, IL (United States); Argonne National Laboratory (ANL), Argonne, IL (United States). Center for Molecular Engineering

Low-loss superconducting aluminium cables and on-chip impedance transformers can be used to link qubit modules and create superconducting quantum computing networks with high-fidelity intermodule state transfer. Scaling is now a key challenge in superconducting quantum computing. One solution is to build modular systems in which smaller-scale quantum modules are individually constructed and calibrated and then assembled into a larger architecture. This, however, requires the development of suitable interconnects. Here we report low-loss interconnects based on pure aluminium coaxial cables and on-chip impedance transformers featuring quality factors of up to 8.1 x 10⁵, which is comparable with the performance of our transmon qubits fabricated on a single-crystal sapphire substrate. We use these interconnects to link five quantum modules with intermodule quantum state transfer and Bell state fidelities of up to 99%. To benchmark the overall performance of the processor, we create maximally entangled, multiqubit Greenberger-Horne-Zeilinger states. The generated intermodule four-qubit Greenberger-Horne-Zeilinger state exhibits 92.0% fidelity. We also entangle up to 12 qubits in a Greenberger-Horne-Zeilinger state with 55.8 ± 1.8% fidelity, which is above the genuine multipartite entanglement threshold of 1/2.

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Research Organization:: Argonne National Laboratory (ANL), Argonne, IL (United States)

Sponsoring Organization:: USDOE; National Natural Science Foundation of China (NSFC); Key Area Research and Development Program of Guangdong Province; Guangdong Provincial Key Laboratory; Science, Technology and Innovation Commission of Shenzhen Municipality; Shenzhen-Hong Kong Cooperation Zone for Technology and Innovation; National Science Foundation of Beijing

Grant/Contract Number:: AC02-06CH11357; U1801661; 12174178; 2019B121203002; KYTDPT20181011104202253; KQTD20210811090049034; HZQB-KCZYB-2020050; Z190012

OSTI ID:: 1989368

Journal Information:: Nature Electronics, Vol. 6, Issue 3; ISSN 2520-1131

Publisher:: Springer NatureCopyright Statement

Country of Publication:: United States

Language:: English

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