Seamless Hybrid-integrated Interconnect NEtwork (SHINE)
- Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)
Large-scale date centers are becoming increasingly limited by the capacity of interconnects due to the rapid increasing power consumption and bandwidth demands driven by the rigorous down scaling of CMOS critical dimensions in according with the Moore’s Law. As a result of the continuing bandwidth scaling, optical interconnects based on parallel optics, where data are simultaneously transmitted along more than one lane, have becoming a preferred interconnected solution over copper cables. To building an efficient optical interconnect system, optical coupling between different elements, such as optical fibers, photonics chips, is a critical step, which is challenging due to the mode mismatch of varies optical ports. In this project, we proposed and demonstrated an optical interfacing scheme, which provided a light coupling approach with low energy loss, broadband operation, high alignment tolerance and compatible with scalable fabrication and testing. Here, the mode transformation is achieved by a total internal reflection from a chip integrated microscale freefrom surface. Due to the enormous light wavefront manipulating ability associated with the gigantic design space, the freeform couplers platform is universally applicable to a wide range of optical coupling scenarios, such as the interfacing between a waveguide to a fiber, another waveguide, surface normal device, or free space.
- Research Organization:
- Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)
- Sponsoring Organization:
- USDOE Advanced Research Projects Agency - Energy (ARPA-E)
- DOE Contract Number:
- AR0000847
- OSTI ID:
- 1832317
- Report Number(s):
- DOE-MIT-AR0000847
- Country of Publication:
- United States
- Language:
- English
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