The ABC130 barrel module prototyping programme for the ATLAS strip tracker

Journal Article · Thu Sep 03 00:00:00 EDT 2020 · Journal of Instrumentation

DOI:https://doi.org/10.1088/1748-0221/15/09/p09004· OSTI ID:1756369

Poley, L.; Sawyer, C.; Addepalli, S.; Affolder, A. A.; Allongue, B.; Allport, P.; Anderssen, E.; Anghinolfi, F.; Arguin, J. -F.; Arling, J. -H.; Arnaez, O.; Asbah, N. A.; Ashby, J.; Asimakopoulou, E. M.; Atlay, N. B.; Bartsch, L.; Basso, M. J.; Beacham, J.; Beaupré, S. L.; Beck, G. ; Beichert, C.; Bergsten, L.; Bernabeu, J.; Bhattarai, P.; Bloch, I.; Blue, A. J.; Bochenek, M.; Botte, J.; Boynton, L.; Brenner, R.; Brueers, B.; Buchanan, E.; Bullard, B.; Capocasa, F.; Carr, I.; Carra, S.; Chao, C. W.; Chen, J.; Chen, L.; Chen, Y.; Chen, X.; Cindro, V.; Ciocio, A.; Civera, J. V.; Cormier, K.; Cornell, E.; Crick, B.; Dabrowski, W.; Dam, M.; David, C.; Demontigny, G.; Dette, K.; DeWitt, J.; Diez, S.; Doherty, F.; Dopke, J.; Dressnandt, N.; Edwards, S.; Fadeyev, V.; Farrington, S.; Fawcett, W.; Fernandez-Tejero, J.; Filmer, E.; Fleta, C.; Gallop, B.; Galloway, Z.; Argos, C. Garcia; Garg, D.; Gignac, M.; Gillberg, D.; Giovinazzo, D.; Glover, J.; Goettlicher, P.; Gonella, L.; Gorišek, A.; Grant, C.; Grant, F.; Gray, C.; Greenall, A.; Gregor, I.; Greig, G.; Grillo, A. A.; Gu, S.; Guescini, F.; Costa, J. da; Gunnell, J.; Gupta, R.; Haber, C.; Halgheri, A.; Hamersly, D.; Haugen, T. E.; Hauser, M.; Heim, S.; Heim, T.; Helling, C.; Herde, H.; Hessey, N. P.; Hommels, B.; Hönig, J. C.; Hunter, A.; Jackson, P.; Jewkes, K.; John, J. J.; Johnson, T. A.; Jones, T.; Kachiguin, S.; Kang, N.; Kaplon, J.; Kareem, M.; Keener, P.; Keller, J.; Key-Charriere, M.; Kilani, S.; Kisliuk, D.; Klein, C. T.; Koffas, T.; Kramberger, G.; Krizka, K.; Kroll, J.; Kuehn, S.; Kurth, M.; Labitan, C.; Lacasta, C.; Lacker, H.; León, P.; Li, B.; Li, C.; Li, Y.; Li, Z.; Liang, Z.; Liberatore, M.; Lister, A.; Liu, K.; Liu, P.; Lohse, T.; Lönker, J.; Lou, X.; Lu, W.; Luce, Z.; Lynn, D.; MacFadyen, R.; Mägdefessel, S.; Mahboubi, K.; Malik, U.; Mandić, I.; Marra, D. La; Martin, J.; Martinez-Mckinney, F.; Mikestikova, M.; Mikuž, M.; Mitra, A.; Mladina, E.; Montalbano, A.; Monzat, D.; Morii, M.; Mullier, G.; Neundorf, J.; Newcomer, M.; Ng, Y.; Nikolica, A.; Nikolopoulos, K.; Oechsle, J.; Oliver, J.; Orr, R. S.; Ottino, G.; Paillard, C.; Pani, P.; Paowell, S.; Parzefall, U.; Phillips, P. W.; Platero, A.; Platero, V.; Prahl, V.; Pyatt, S.; Ran, K.; Reardon, N.; Rehnisch, L.; Renardi, A.; Renzmann, M.; Rifki, O.; Rodriguez, A. Rodriguez; Rosin, G.; Rossi, E.; Ruggeri, T.; Rühr, F.; Rymaszewski, P.; Sadrozinski, H. F.-W.; Sanethavong, P.; Santpur, S. Neha; Scharf, C.; Schillaci, Z.; Schmitt, S.; Sharma, A.; Sciolla, G.; Seiden, A.; Shi, X.; Simpson-Allsop, C.; Snoek, H.; Snow, S.; Solaz, C.; Soldevila, U.; Sousa, F.; Sperlich, D.; Staats, E.; Stack, T. L.; Stanitzki, M.; Starinsky, N.; Steentoft, J.; Stegler, M.; Stelzer, B.; Stucci, S.; Swientek, K.; Taylor, G. N.; Taylor, W.; Teoh, J. Jian; Teuscher, R.; Thomas, J.; Tigchelaar, A.; Tran, T.; Tricoli, A.; Trischuk, D. A.; Unno, Y.; Nieuwenhuizen, G. van; Ullán, M.; Vermeulen, J.; Leitao, P. Vicente; Vickey, T.; Vidal, G.; Vreeswijk, M.; Warren, M.; Weidberg, T.; Wiehe, M.; Wiglesworth, C.; Wiik-Fuchs, L.; Williams, S.; Wilson, J.; Witharm, R.; Wizemann, F.; Wonsak, S.; Worm, S.; Wormald, M.; Xella, S.; Yang, Y.; Yarwick, J.; Yu, T.; Zhang, D.; Zhang, K.; Zhou, M.; Zhu, H.

For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

• Research Organization: Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
• Sponsoring Organization: USDOE Office of Science (SC); National Key Programme for S&T Research and Development; Science and Technology Facilities Council (STFC) (United Kingdom); Polish Ministry of Science and Higher Education; Canada Foundation for Innovation; Natural Sciences and Engineering Research Council of Canada (NSERC); Australian Research Council (ARC)
• Contributing Organization: ATLAS Collaboration
• Grant/Contract Number: AC02-05CH11231; SC0010107; 2016YFA0400101; ST/R002592/1; DIR/WK/2018/04
• OSTI ID: 1756369
• Journal Information: Journal of Instrumentation, Vol. 15, Issue 09; ISSN 1748-0221
• Publisher: Institute of Physics (IOP)
• Country of Publication: United States
• Language: English

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