Aluminum nitrides. (Latest citations from the US Patent bibliographic file with exemplary claims). Published Search
Technical Report
·
OSTI ID:167006
The bibliography contains citations of selected patents concerning aluminum nitride (AlN) materials and products. The manufacture of AlN powders, films, layers, flakes, coatings, and substrates is described. Sintered bodies with high thermal conductivity, low permittivity, high mechanical strength, and excellent durability are included. Applications cover highly integrated circuits, circuit boards, electronic packaging, ceramics, and heat conduction. (Contains 50-250 citations and includes a subject term index and title list.) (Copyright NERAC, Inc. 1995)
- Research Organization:
- NERAC, Inc., Tolland, CT (United States)
- OSTI ID:
- 167006
- Report Number(s):
- PB-96-853700/XAB; TRN: 53523502
- Resource Relation:
- Other Information: PBD: Nov 1995
- Country of Publication:
- United States
- Language:
- English
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