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Title: Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in [Phase 3 Memory,] 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices

Journal Article · · Journal of Electronic Materials
 [1];  [1];  [2];  [1]
  1. Singapore Univ. of Technology and Design (SUTD) (Singapore)
  2. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

Synchrotron x-ray microdiffraction (μXRD) allows characterization of a crystalline material in small, localized volumes. Phase composition, crystal orientation and strain can all be probed in few-second time scales. Crystalline changes over a large areas can be also probed in a reasonable amount of time with submicron spatial resolution. However, despite all the listed capabilities, μXRD is mostly used to study pure materials but its application in actual device characterization is rather limited. This article will explore the recent developments of the μXRD technique illustrated with its advanced applications in microelectronic devices and solar photovoltaic systems. Application of μXRD in microelectronics will be illustrated by studying stress and microstructure evolution in Cu TSV (through silicon via) during and after annealing. Here, the approach allowing study of the microstructural evolution in the solder joint of crystalline Si solar cells due to thermal cycling will be also demonstrated.

Research Organization:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
DOE Contract Number:
AC02-05CH11231
OSTI ID:
1379596
Journal Information:
Journal of Electronic Materials, Vol. 45, Issue 12; ISSN 0361-5235
Publisher:
Springer
Country of Publication:
United States
Language:
English

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Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction journal July 2008
Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe journal November 2014
Matrix cracking in intermetallic composites caused by thermal expansion mismatch journal August 1991
In-situ characterization of highly reversible phase transformation by synchrotron X-ray Laue microdiffraction journal May 2016
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits journal March 2012
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Plasticity evolution in nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron X-ray microdiffraction journal May 2015
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Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment journal September 2010
Real-time microstructure imaging by Laue microdiffraction: A sample application in laser 3D printed Ni-based superalloys journal June 2016
Low Stress Encapsulants? Influence of Encapsulation Materials on Stress and Fracture of Thin Silicon Solar Cells as Revealed by Synchrotron X-ray Submicron Diffraction journal January 2016
Synchrotron X-ray Micro-diffraction – Probing Stress State in Encapsulated Thin Silicon Solar Cells journal January 2016
Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing journal February 2012
On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology journal January 2016

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